September 12, 2024 – Shenzhen-based Matrix Technology, a leading player in the semiconductor advanced packaging sector, has successfully closed a billion yuan B2 round of funding. The round was jointly invested by China Railway Capital, Wisdom Linkage Industrial Fund, Qianhai Mother Fund, and Yida Capital. The funds raised will be primarily allocated to the research and development of next-generation advanced packaging PVD (Physical Vapor Deposition) production equipment, expansion of production capacity, and supplementing working capital.
Matrix Technology, also known as Matrix Diversified Technology Co., Ltd., has been focusing on the thin-film deposition process in semiconductor advanced packaging. The company has mastered the key technologies of international leading magnetron sputtering PVD equipment and possesses the capability to design, produce, and deliver complete machine platforms. Matrix Technology has independently developed a number of critical subsystems, including sputtering cathode systems and panel-level packaging wafer loading systems.
This significant funding round marks a major milestone for Matrix Technology as it continues to expand its presence in the semiconductor advanced packaging industry. The investment will enable the company to accelerate the development of its PVD production equipment, which is crucial for the manufacturing of high-performance semiconductor devices.
The PVD technology is a key process in semiconductor manufacturing, which involves depositing thin films of materials onto substrates. Matrix Technology’s expertise in this area is expected to enhance the efficiency and quality of semiconductor production, ultimately contributing to the growth of the global semiconductor industry.
The participation of prominent investors such as China Railway Capital, Wisdom Linkage Industrial Fund, Qianhai Mother Fund, and Yida Capital demonstrates the strong confidence in Matrix Technology’s future prospects. These investors are well-known for their involvement in high-tech industries and their commitment to supporting innovative companies.
With the support of these investors, Matrix Technology plans to further expand its production capacity and enhance its product portfolio. The company aims to become a leading provider of advanced packaging solutions for the global semiconductor industry.
The successful closure of the B2 round of funding also highlights the growing interest in the semiconductor industry among Chinese investors. As the global demand for semiconductors continues to rise, Chinese companies are increasingly focusing on the development of advanced packaging technologies to maintain their competitiveness in the market.
Matrix Technology’s commitment to innovation and technological advancement has positioned the company as a key player in the semiconductor advanced packaging sector. The company’s expertise in PVD technology and its ability to develop cutting-edge products have set it apart from its competitors.
In conclusion, Matrix Technology’s B2 round of funding is a significant development for the company and the semiconductor industry as a whole. The investment will enable the company to continue its growth trajectory and contribute to the advancement of semiconductor manufacturing technologies. With the support of its investors, Matrix Technology is well-positioned to become a leader in the global semiconductor advanced packaging market.
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