【财联社讯】在2月18日至22日于美国加州圣何塞举行的国际固态电路会议（ISSCC 2024）上，全球领先的半导体制造企业台积电（TSMC）展示了其在高性能计算与人工智能（AI）芯片封装技术方面的最新进展。台积电的这项新技术在现有的3D封装技术基础上，进一步融合了硅光子技术，旨在提升芯片间的互联效果并降低功耗。
据台积电业务开发资深副总裁张晓强介绍，这项技术能够支持更多的高性能内存接口（HBM）和芯片级（Chiplet）小芯片集成，从而显著提升AI芯片的计算性能。硅光子技术的高速、低功耗特性，使得芯片间的通信速度更快，同时减少了能量消耗，这对于追求极致性能的AI应用至关重要。
台积电的这一创新举措，不仅推动了半导体行业的技术进步，也为未来的高性能计算和AI应用提供了强有力的技术支持。随着AI技术的不断发展，对高性能计算的需求日益增长，台积电的这项新技术无疑将为这一领域的创新和发展注入新的动力。
英语如下：
Title: “TSMC Unveils New Packaging Technology to Enhance AI Chip Performance”
Keywords: Packaging Technology, Silicon Photonics, AI Chips
News Content:
[Taiwan Financial Times] At the International Solid-State Circuits Conference (ISSCC 2024) held in San Jose, California, from February 18 to 22, Taiwan Semiconductor Manufacturing Company (TSMC), the world’s leading semiconductor manufacturer, showcased its latest advancements in packaging technology for high-performance computing and artificial intelligence (AI) chips. TSMC’s new technology builds upon existing 3D packaging techniques and further integrates silicon photonics to improve interconnects between chips and reduce power consumption.
According to Dr. Zhang Xiaojiang, Senior Vice President of Business Development at TSMC, the technology supports more high-bandwidth memory (HBM) interfaces and chiplet integration, significantly boosting the computational performance of AI chips. The high-speed and low-power characteristics of silicon photonics enable faster communication between chips while reducing energy consumption, which is crucial for AI applications that demand peak performance.
TSMC’s innovative move not only advances the semiconductor industry but also provides robust technical support for future high-performance computing and AI applications. As AI technology continues to evolve, the demand for high-performance computing grows, and TSMC’s new technology will undoubtedly inject new momentum into the innovation and development of this field.
【来源】https://www.cls.cn/detail/1601181
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