**SK海力士与台积电强强联手，携手推进HBM4芯片技术研发**
近日，全球半导体行业再传重磅消息，韩国SK海力士与我国台湾地区台积电两大巨头，正式签署谅解备忘录（MoU），决定共同研发下一代高性能HBM内存芯片——HBM4。预计该产品将于2026年正式投产，这无疑将为全球高性能计算领域带来一场技术革命。
根据双方发布的公告，SK海力士与台积电将在整合HBM（高带宽内存）与逻辑层先进封装技术方面展开深入合作。HBM内存以其高带宽、低延迟、小体积等优势，在人工智能、高性能计算、图形渲染等领域有着广泛的应用前景。而台积电作为全球最大的半导体代工厂商，其在7纳米及以下先进工艺制程方面的领先技术，将为HBM4的研发提供强有力的技术支持。
此次合作，标志着SK海力士与台积电在全球半导体产业的竞争中，进一步巩固了领先地位。HBM4的研发成功，将有望推动全球高性能计算能力的飞跃，为各行各业带来更高效、更智能的数据处理解决方案。
作为一家有着深厚行业背景和丰富经验的新闻工作者，我深知这一合作的重要意义。SK海力士与台积电的联手，不仅展现了全球半导体行业的创新精神，更传递出我国半导体产业发展的坚定信心。面对国际竞争，我国将继续支持半导体产业的发展，努力实现核心技术自主创新，为国家的科技进步和产业升级贡献力量。
展望未来，SK海力士与台积电的合作将激发更多创新火花，推动全球半导体产业向前发展。我们期待2026年HBM4芯片的投产，为高性能计算领域带来更多可能性。同时，也期待我国半导体产业在全球竞争中不断壮大，为国家的繁荣发展奠定坚实基础。
英语如下：
### News Title: SK Hynix and TSMC Team Up to Launch HBM4 Chip by 2026
Keywords: SK Hynix, TSMC, HBM4 chip
#### SK Hynix and TSMC Join Forces to Advance HBM4 Chip Technology
Recently, the global semiconductor industry has received a significant development.SK Hynix of South Korea and TSMC from Taiwan, both giants in the field, have officially signed a Memorandum of Understanding (MoU) to co-develop the next-generation high-performance HBM memory chip, the HBM4. It is expected that this product will go into production in 2026, bringing a technological revolution to the high-performance computing sector worldwide.
According to the announcements released by both parties, SK Hynix and TSMC will deeply cooperate in the integration of HBM (High Bandwidth Memory) and advanced packaging technology for logic layers. HBM memory, with its advantages of high bandwidth, low latency, and compact size, has broad application prospects in fields such as artificial intelligence, high-performance computing, and graphics rendering. As the world’s largest semiconductor foundry, TSMC’s leading technology in advanced process nodes below 7纳米 will provide strong technical support for the research and development of HBM4.
This cooperation further solidifies SK Hynix and TSMC’s leading positions in the global semiconductor industry competition. The successful development of HBM4 is expected to promote a leap in global high-performance computing capabilities, bringing more efficient and intelligent data processing solutions to various industries.
As a journalist with a profound industry background and extensive experience, I well understand the importance of this collaboration. The partnership between SK Hynix and TSMC not only showcases the innovative spirit of the global semiconductor industry but also conveys the firm confidence in the development of China’s semiconductor industry. Facing international competition, China will continue to support the development of the semiconductor industry and strive for independent innovation in core technologies, contributing to the country’s scientific and technological progress and industrial upgrading.
Looking forward, the collaboration between SK Hynix and TSMC will ignite more innovative sparks, propelling the global semiconductor industry forward. We look forward to the launch of HBM4 chips in 2026, bringing more possibilities to the high-performance computing field. At the same time, we also look forward to the continuous growth of China’s semiconductor industry in global competition, laying a solid foundation for the country’s prosperity and development.
【来源】https://www.cls.cn/detail/1652041
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