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【三星加速AI芯片开发,组建HBM产能质量提升团队】

三星电子近日宣布,为强化其在人工智能(AI)半导体领域的竞争力,公司已组建了一支由DRAM产品与技术负责人Hwang Sang-joon领导的HBM内存产能与质量提升团队。这一举措是三星DS部门负责人庆桂显在社交媒体上透露的双轨AI半导体策略的一部分,旨在同步提升AI用存储芯片和AI算力芯片的创新能力。

HBM(High-Bandwidth Memory,高带宽内存)是高性能计算和AI应用中的关键组件,能提供比传统内存更高的数据传输速度。三星此次组建的团队是今年建立的第二个专门致力于HBM的团队,反映出三星对于提升AI芯片性能的紧迫性和决心。通过增强HBM的产能和质量,三星旨在为AI推理芯片Mach-2的开发提供更坚实的技术支持。

三星的双轨策略表明,其不仅在AI计算芯片的研发上持续发力,同时也在AI存储解决方案上寻求突破。这一战略的实施将有助于三星在日益激烈的AI半导体市场竞争中占据有利地位,进一步巩固其在全球半导体行业的领导地位。未来,三星有望通过这样的技术创新,为数据中心、云计算以及人工智能应用带来更高效、更强大的性能支持。

英语如下:

**News Title:** “Samsung Accelerates AI Chip Development with Enhanced HBM Team for Mach-2 Launch”

**Keywords:** Samsung Electronics, AI Chips, HBM Team

**News Content:**

Samsung Electronics recently announced that it has established a High-Bandwidth Memory (HBM) production and quality improvement team, led by DRAM product and technology head Hwang Sang-joon, to strengthen its competitiveness in the artificial intelligence (AI) semiconductor sector. This move is part of Samsung DS division head Kyung Kye-hyun’s dual-track AI semiconductor strategy, disclosed on social media, which aims to simultaneously boost innovation in AI storage chips and AI computing chips.

HBM, a critical component in high-performance computing and AI applications, offers significantly higher data transfer speeds than conventional memory. Samsung’s formation of this second dedicated HBM team this year underscores the company’s urgency and commitment to enhancing AI chip performance. By strengthening HBM production and quality, Samsung aims to provide robust technical support for the development of its AI inference chip, Mach-2.

Samsung’s dual-track strategy indicates its ongoing investment in AI computing chip research and development, alongside its pursuit of breakthroughs in AI storage solutions. The implementation of this strategy positions Samsung favorably in the increasingly competitive AI semiconductor market, reinforcing its global leadership in the semiconductor industry. In the future, Samsung is expected to leverage such technological innovations to deliver more efficient and powerful performance support to data centers, cloud computing, and AI applications.

【来源】https://www.ithome.com/0/759/317.htm

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