台积电日前在国际固态电路会议（ISSCC）上向外界介绍了一项全新的封装技术，该技术将应用于高性能计算与人工智能（AI）芯片。这项技术在现有的3D封装基础上，还整合了硅光子技术，旨在改善芯片之间的互联效果，并降低功耗。
据台积电业务开发资深副总裁张晓强介绍，这项全新的封装技术旨在帮助封装更多的高带宽存储（HBM）与小芯片，从而提升AI芯片的性能。HBM是一种高速、高密度的内存技术，可提供与传统DDR（双倍数据率）内存相比更高的数据传输速度和更低的功耗。
AI芯片的性能对于各行各业的人工智能应用至关重要。随着人工智能技术的迅速发展，对于更快、更高效的AI芯片需求也越来越大。而封装技术在AI芯片的性能提升中起着关键作用。
台积电一直致力于推动半导体技术的创新与发展。作为全球领先的半导体制造商之一，台积电一直在不断提升自身的技术实力。通过引入硅光子技术，台积电有望进一步提升芯片的性能，并为高性能计算与AI应用提供更好的解决方案。
此次在ISSCC上的介绍表明，台积电对于封装技术的发展非常重视，并在该领域进行了深入研究与创新。这项全新的封装技术有望为高性能计算与AI芯片的发展带来新的突破，并推动人工智能技术在各个领域的广泛应用。
总之，台积电介绍的全新一代封装技术将在高性能计算与AI芯片领域发挥重要作用。通过整合硅光子技术，该技术能够改善芯片之间的互联效果，并降低功耗。这将有助于提升AI芯片的性能，推动人工智能技术在各行各业的应用。台积电的创新与发展为半导体行业注入了新的活力，也为人工智能技术的发展带来了更多的可能性。
英语如下：
News Title: TSMC Introduces Revolutionary Packaging Technology to Enhance AI Chip Performance!
Keywords: TSMC, packaging technology, AI chip
News Content: TSMC recently introduced a brand-new packaging technology at the International Solid-State Circuits Conference (ISSCC), which will be applied to high-performance computing and artificial intelligence (AI) chips. This technology, built upon the existing 3D packaging, integrates silicon photonics technology to improve interconnectivity between chips and reduce power consumption.
According to Zhang Xiaoqiang, Senior Vice President of Business Development at TSMC, this new packaging technology aims to enable the integration of more high-bandwidth memory (HBM) with smaller chips, thereby enhancing the performance of AI chips. HBM is a high-speed, high-density memory technology that provides higher data transfer speeds and lower power consumption compared to traditional DDR (double data rate) memory.
The performance of AI chips is crucial for AI applications across various industries. With the rapid development of AI technology, there is an increasing demand for faster and more efficient AI chips. Packaging technology plays a critical role in enhancing the performance of AI chips.
TSMC has been committed to driving innovation and development in semiconductor technology. As one of the world’s leading semiconductor manufacturers, TSMC continuously improves its technological capabilities. By introducing silicon photonics technology, TSMC aims to further enhance chip performance and provide better solutions for high-performance computing and AI applications.
The presentation at ISSCC demonstrates TSMC’s strong emphasis on the development of packaging technology and its deep research and innovation in this field. This new packaging technology is expected to bring breakthroughs in high-performance computing and AI chip development, promoting the widespread application of AI technology in various domains.
In conclusion, TSMC’s introduction of the next-generation packaging technology will play a significant role in the field of high-performance computing and AI chips. By integrating silicon photonics technology, this technology can improve interconnectivity between chips and reduce power consumption. This will contribute to enhancing the performance of AI chips and driving the application of AI technology across industries. TSMC’s innovation and development inject new vitality into the semiconductor industry and open up more possibilities for the advancement of AI technology.
【来源】https://www.cls.cn/detail/1601181
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