台积电在2月18日至22日召开的国际固态电路研讨会(ISSCC)上,向外界介绍了一种用于高性能计算和AI芯片的新一代封装技术。这种技术在现有的3D封装基础上,整合了硅光子技术,旨在改善芯片之间的互联效果、降低功耗。据台积电业务开发高级副总裁张晓强介绍,这项技术可以帮助封装更多高带宽内存(HBM)和切片小芯片(Chiplet),从而提升AI芯片的性能表现。
Title: TSMC Unveils New-Gen Packaging Tech for AI Chips
Keywords: TSMC, AI chips, packaging technology
News content: Taiwan Semiconductor Manufacturing Company (TSMC) introduced a new generation packaging technology for high-performance computing and AI chips at the International Solid-State Circuits Conference (ISSCC) held from February 18-22. Integrating silicon photonics into existing 3D packaging tech, the new solution aims to improve interconnections among chips and reduce power consumption. According to TSMC Senior Vice President of Business Development Dr. Kevin Zhang, the technology can help package more high bandwidth memory (HBM) and chiplets to boost AI chip performance.
【来源】https://www.cls.cn/detail/1601181
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