在2月18日至22日举行的ISSCC 2024上，全球半导体巨头台积电展示了其最新的封装技术，这一技术专为高性能计算和AI芯片设计，旨在进一步提升芯片的性能和能效。台积电业务开发资深副总裁张晓强在会上详细介绍了这项创新技术，它不仅继承了3D封装技术，还整合了硅光子技术，以实现更快的数据传输速度和更低的功耗。
台积电的这一突破性技术，通过优化芯片间的互联效果，使得高性能计算和AI芯片能够封装更多的高带宽内存（HBM）和Chiplet小芯片。这种设计使得芯片能够更有效地处理复杂的计算任务，同时减少能量消耗，这对于数据中心和云计算等应用领域来说至关重要。
随着人工智能和机器学习技术的快速发展，对高性能计算能力的需求日益增长。台积电的这一技术进步，不仅展示了其在半导体制造领域的领先地位，也为整个行业树立了新的标准。通过这项技术，台积电有望进一步巩固其在高性能计算和AI芯片市场的领导地位。
英文标题：TSMC Unveils Next-Gen AI Chip Packaging Technology
英文关键词：High-Performance Computing, AI Chips, Packaging Innovation
英文新闻内容：
At the ISSCC 2024 conference from February 18th to 22nd, TSMC, the global semiconductor giant, showcased its latest packaging technology tailored for high-performance computing and AI chips. The innovative technology aims to further enhance chip performance and energy efficiency. Zhang Xiaoqiang, TSMC’s Senior Vice President of Business Development, provided a detailed introduction to the breakthrough technology, which inherits 3D packaging techniques and integrates silicon photonics technology for faster data transmission and lower power consumption.
TSMC’s groundbreaking technology allows for more HBM and Chiplet chips to be packaged within high-performance computing and AI chips by optimizing inter-chip connectivity. This design enables chips to handle complex computational tasks more efficiently while reducing energy consumption, which is crucial for applications in data centers and cloud computing.
With the rapid advancement of artificial intelligence and machine learning technologies, the demand for high-performance computing power is growing. TSMC’s technological progress not only demonstrates its leading position in the semiconductor manufacturing industry but also sets a new standard for the entire industry. With this technology, TSMC is expected to further consolidate its leadership in the high-performance computing and AI chip market.
【来源】https://www.cls.cn/detail/1601181
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