德国慕尼黑初创公司Semron近日完成了730万欧元的种子轮融资。此轮融资由Join Capital领投，SquareOne、OTB Ventures、Hermann Hauser的Onsight Ventures和现有投资者参与。Semron公司专注于开发突破性的3D AI芯片技术，该技术有望革新智能设备的半导体领域。
Semron的3D AI芯片技术旨在提升智能设备的性能和效率，为人工智能应用提供更高水平的处理能力。该公司表示，其芯片技术将打破现有技术的局限，为智能设备带来更快的速度、更高的能效和更小的体积。
这家总部位于德国慕尼黑的初创公司表示，它将利用这笔资金加速其3D AI芯片的研发工作，并进一步扩大其团队规模。Semron公司成立于2018年，由一支经验丰富的半导体行业专家组成，他们有着在芯片设计和制造领域的深厚背景。
Join Capital的合伙人表示，他们对Semron的技术和团队非常看好，相信他们能够改变智能设备半导体领域的现状。SquareOne、OTB Ventures和Hermann Hauser的Onsight Ventures等投资机构也表示，他们看好Semron公司的未来发展潜力。
Semron公司的创始人兼首席执行官表示，感谢投资方对他们的支持，他们将不负众望，继续推动3D AI芯片技术的发展，为智能设备领域带来更多的创新。
Title: Breakthrough 3D AI Chip Company Semron Raises €7.3 Million in Seed Funding
Keywords: AI chip, financing, technological breakthrough
News content: Munich-based startup Semron has recently completed a €7.3 million seed round of financing. This round of financing was led by Join Capital, with participation from SquareOne, OTB Ventures, Onsight Ventures of Hermann Hauser, and existing investors. Semron focuses on developing groundbreaking 3D AI chip technology, which is expected to revolutionize the semiconductor field for smart devices.
Semron’s 3D AI chip technology aims to enhance the performance and efficiency of smart devices, providing a higher level of processing capability for artificial intelligence applications. The company says its chip technology will break through the limitations of existing technologies, bringing faster speed, higher energy efficiency, and smaller size to smart devices.
The startup, based in Munich, Germany, plans to use the funds to accelerate the research and development of its 3D AI chips and further expand its team. Semron was founded in 2018 by a team of experienced semiconductor industry experts with a deep background in chip design and manufacturing.
Partners from Join Capital expressed optimism about Semron’s technology and team, believing they have the potential to change the status quo of the smart device semiconductor market. Investment institutions such as SquareOne, OTB Ventures, and Onsight Ventures of Hermann Hauser also said they see great potential for Semron’s future development.
Semron’s founder and CEO said that they are grateful for the support of the investors and will continue to push forward with the development of 3D AI chip technology to bring more innovation to the smart device field.
【来源】https://venturebeat.com/ai/semron-raises-7-9m-for-ai-chips-with-3d-packaging/
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