深圳鲲云信息科技有限公司（以下简称“鲲云科技”）近日宣布完成数亿元的C轮融资。此轮融资由普罗资本领投，鼎晖百孚、联通旗下联创基金、张科垚坤基金、钟楼金控集团跟投。鲲云科技将利用这笔资金支持下一代可重构数据流CAISA AI芯片的研发和规模落地，以构建CAISA芯片在各垂直行业的产业化生态。
作为一家专注于AI芯片领域的创新型企业，鲲云科技凭借其领先的技术和产品，赢得了市场的认可和投资者的青睐。此次融资将有助于鲲云科技进一步扩大研发投入，推动AI芯片技术的创新与应用。
英文翻译：
Kunxun Technology Announces Series C Financing of hundreds of millions of dollars
Keywords: Kunxun Technology, Series C financing, AI chips
News Content:
Kunxun Information Technology Co., Ltd. (hereinafter referred to as “Kunxun Technology”) recently announced the completion of hundreds of millions of dollars in Series C financing. This round of financing was led by Pro Capital, with participation from Dinghui Baihuo, China Unicom’s Lianchuang Fund, Zhang Keyun坤Fund, and Zhonglou Jinkong Group. The funds will be used to support the research and development of the next-generation reconfigurable data flow CAISA AI chips and their large-scale deployment, aiming to build an industrial ecosystem for CAISA chips in various vertical industries.
As an innovative company focusing on the field of AI chips, Kunxun Technology has won market recognition and investor favor with its leading technology and products. This round of financing will help Kunxun Technology further increase R&D investments and promote innovation and application of AI chip technology.
【来源】https://www.36kr.com/p/2579176272078464
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