德国慕尼黑的半导体初创公司Semron近日成功筹集了730万欧元（约合790万美元）的种子资金。这笔资金将用于支持其突破性的3D AI芯片技术研发，该技术有望颠覆智能设备的半导体领域。
此次融资由Join Capital领投，SquareOne、OTB Ventures、Hermann Hauser的Onsight Ventures以及现有投资者参与。Semron的3D AI芯片技术具有巨大潜力，旨在改变传统智能设备的性能和能效。该公司表示，其技术将助力智能设备实现更高速的运算速度、更低的功耗以及更高的集成度。
作为一家初创公司，Semron在半导体领域取得了显著的成果。此轮融资的成功，不仅为Semron带来了强大的资本支持，还为其技术研发和市场拓展提供了有力保障。未来，Semron将继续深耕AI芯片领域，推动智能设备行业的创新与发展。
英文翻译：
News Title: German startup Semron raises $7.9 million in seed funding
Keywords: Semron, AI chip, financing
News Content:
German semiconductor startup Semron has successfully raised €7.3 million ($7.9 million) in seed funding. The funds will be used to support the development of its groundbreaking 3D AI chip technology, which is aimed at transforming the semiconductor industry in smart devices.
The round of financing was led by Join Capital, with participation from SquareOne, OTB Ventures, Onsight Ventures of Hermann Hauser, and existing investors. Semron’s 3D AI chip technology has huge potential and is designed to improve the performance and energy efficiency of traditional smart devices. The company claims that its technology will enable faster computing speeds, lower power consumption, and higher integration levels for smart devices.
As a startup, Semron has achieved significant success in the semiconductor field. The success of this round of financing will not only provide strong financial support for Semron but also offer a boost to its technology research and market expansion. Looking forward, Semron will continue to focus on the AI chip sector and promote innovation and development in the smart device industry.
【来源】https://venturebeat.com/ai/semron-raises-7-9m-for-ai-chips-with-3d-packaging/
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