**SK海力士计划将HBM产能增加一倍以上，加注AI**
**韩国首尔–(美国商业资讯)–SK海力士公司(SK hynix Inc.)今日宣布，将扩大其高带宽内存(HBM)生产设施投资，以满足不断增长的AI需求。**
SK海力士计划将通过硅通孔(TSV)相关的设施投资比2023年增加一倍以上，力图将产能翻倍。该公司还计划在2024年上半年开始生产其第五代高带宽内存产品HBM3E，以应对高性能AI产品需求的增加。
HBM是一种高性能内存，可提供比传统内存更高的带宽和更低的功耗。它通常用于需要快速数据访问的应用，例如AI、机器学习和图形处理。
SK海力士是全球领先的HBM制造商之一。该公司目前拥有超过50%的HBM市场份额。通过扩大其HBM生产设施投资，SK海力士希望进一步巩固其在该市场的领先地位。
SK海力士首席执行官李锡熙表示：“随着AI和机器学习等高性能计算应用的不断增长，对HBM的需求也在不断增加。我们正在扩大我们的HBM生产设施投资，以满足这一需求。我们还计划在2024年上半年开始生产我们的第五代HBM产品HBM3E，以提供更高的带宽和更低的功耗。”
SK海力士的HBM生产设施投资将有助于该公司满足不断增长的AI需求。该公司的HBM产品将用于各种AI应用，包括自动驾驶汽车、面部识别和自然语言处理。
SK海力士的HBM生产设施投资也是该公司对未来技术投资的一部分。该公司还计划投资其他新技术，例如下一代存储器和计算芯片。
英语如下：
**SK hynix to Double HBM Production Capacity to Fuel AI Growth**
**Keyword: memory technology, AI growth, semiconductor manufacturing**
**SEOUL, South Korea–(BUSINESS WIRE)–SK hynix Inc. today announced that itwill expand its high-bandwidth memory (HBM) production facility investment to meet the growing demand for AI.**
SK hynix plans to more than double its capacity by investing in through- silicon via (TSV)-related facilities compared to 2023. The company also plans to start mass producing its fifth-generation HBM product, HBM3E, in the first half of 2024 to address the increasing demand for high-performance AI products.
HBM is a high-performance memory that offers higher bandwidth and lower power consumption than traditional memory. It is commonly used in applications that require fast data access, such as AI, machine learning, and graphics processing.
SK hynix is one of the leading manufacturers of HBM in the world. The company currently holds over 50% of the HBM market share. By expanding its HBM production facility investment, SK hynix aims to further solidify its leadershipin the market.
“As high-performance computing applications such as AI and machine learning continue to grow, the demand for HBM is also increasing,” said Seok-Hee Lee, CEO of SK hynix. “We are expanding our HBM production facility investment to meet this demand. We also plan to start mass producing our fifth-generation HBM product, HBM3E, in the first half of 2024, which will offer even higher bandwidth and lower power consumption.”
SK hynix’s HBM production facility investment will help the company meet the growing demand for AI. The company’s HBM products will be used in a variety of AI applications, including autonomous vehicles, facial recognition, and natural language processing.
SK hynix’s HBM production facility investment is also part of the company’s investment in future technologies. The company also plans to invest in other emerging technologies, such as next-generation memory and computing chips.
【来源】https://wallstreetcn.com/articles/3707318
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