深圳鲲云信息科技有限公司（以下简称“鲲云科技”）近日宣布完成数亿元的C轮融资。此轮融资由普罗资本领投，鼎晖百孚、联通旗下联创基金、张科垚坤基金、钟楼金控集团跟投。鲲云科技将利用这笔资金支持下一代可重构数据流CAISA AI芯片的研发和规模落地，以构建CAISA芯片在各垂直行业的产业化生态。
作为一家专注于AI芯片技术的公司，鲲云科技凭借其领先的技术和创新能力，吸引了众多投资者的关注。此次融资将有助于推动我国AI芯片产业的发展，为各行业提供更加高效、智能的解决方案。
英文翻译：
News title: Kunxun Technology Announces Series C Financing of hundreds of millions of yuan to Boost AI Chip Development
Keywords: Kunxun Technology, AI chips, Series C financing
News content:
Shenzhen Kunxun Information Technology Co., Ltd. (hereinafter referred to as “Kunxun Technology”) recently announced the completion of hundreds of millions of yuan in Series C financing. The round of financing was led by Pro Capital, with participation from Dingheng Baihuo, China Unicom’s Lianchuang Fund, Zhangkeyao坤Fund, and Zhonglou Jinrong Group. The funds will be used to support the research and development as well as the large-scale implementation of the next-generation reconfigurable data flow CAISA AI chips, in order to build an industrialized ecosystem for CAISA chips in various vertical industries.
As a company focusing on AI chip technology, Kunxun Technology has attracted the attention of numerous investors with its leading technology and innovative capabilities. This financing will contribute to the development of China’s AI chip industry and provide more efficient and intelligent solutions for various industries.
【来源】https://www.36kr.com/p/2579176272078464
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