联发科与谷歌近日宣布合作开发一款新型 Filogic 芯片，该芯片同时支持 Wi-Fi、蓝牙和 Thread 协议，旨在推动智能家居领域的发展。双方计划将该芯片应用于更先进的智能家居产品中，以提供更便捷、安全的智能家居体验。
Filogic 芯片支持 Matter 标准，实现不同制造商设备间的互联互通。此外，联发科还将与谷歌合作，将 Google Home 集成到家用电器中，助力消费者打造智能家居环境。新款 Filogic 芯片采用 2.5 GHz ISM 共享频段，并具备 MediaTek 的共存和卸载功能，实现无缝连接体验。
联发科与谷歌的战略合作，将有助于加速智能家居市场的发展，让消费者享受到更为便捷、智能的生活。随着智能家居设备的普及，支持 Thread 和 Matter 的产品逐渐增多，此次合作有望进一步推动智能家居技术的创新和应用。
Title: MediaTek and Google Collaborate on Advanced Smart Home Chips
Keywords: MediaTek, Google, smart home, Filogic chips
News content:
MediaTek and Google have recently announced a collaboration to develop a new generation of Filogic chips, which support Wi-Fi, Bluetooth, and Thread protocols simultaneously, aiming to promote the development of the smart home field. The two companies plan to apply these chips to more advanced smart home products, providing a more convenient and secure experience for consumers.
Filogic chips support the Matter standard, enabling seamless interconnection between devices from different manufacturers. In addition, MediaTek will collaborate with Google to integrate Google Home into home appliances, helping consumers build a smart home environment. The new Filogic chips adopt a 2.5 GHz ISM shared frequency band and feature coexistence and offloading capabilities from MediaTek, ensuring a seamless connection experience.
The strategic cooperation between MediaTek and Google will accelerate the development of the smart home market, allowing consumers to enjoy a more convenient and intelligent lifestyle. As smart home devices become more popular, products supporting Thread and Matter are gradually increasing. This collaboration is expected to further promote the innovation and application of smart home technology.
【来源】https://www.ithome.com/0/744/378.htm
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