深圳鲲云信息科技有限公司（以下简称“鲲云科技”）近日宣布完成数亿元C轮融资。此轮融资由普罗资本领投，鼎晖百孚、联通旗下联创基金、张科垚坤基金、钟楼金控集团跟投。鲲云科技将利用这笔资金支持下一代可重构数据流CAISA AI芯片的研发和规模落地，以及在各垂直行业的产业化生态建设。
鲲云科技是一家专注于AI芯片研发的公司，此前的融资经历展现了其在业界的实力与潜力。此次C轮融资将有助于鲲云科技进一步拓展AI芯片市场，提升产品技术水平，并为客户提供更优质的服务。鲲云科技表示，将继续致力于推动AI芯片技术在各领域的应用，助力我国AI产业的发展。
英文翻译：
News title: Kuncloud Technology Announces $100 Million Series C Financing to Accelerate AI Chip Development
Keywords: Kuncloud Technology, AI chips, financing, Procapital
News content:
Kuncloud Information Technology Co., Ltd. (hereinafter referred to as “Kuncloud Technology”) recently announced the completion of hundreds of millions of yuan in Series C financing. This round of financing was led by Procapital, with participation from Dinghuai Baifu, China Unicom’s Lianchuang Fund, Zhangkeyou坤Fund, and Zhonglou Jinkong Group. The funds will be used to support the research and development of the next-generation reconfigurable data flow CAISA AI chips and the industrialization ecosystem in various vertical industries.
【来源】https://www.36kr.com/p/2579176272078464
Views: 2