联发科今天发布了其最新的天玑9300旗舰5G生成式AI移动芯片。这款芯片采用“4（超大核）+4（大核）”全大核设计，最高可达330亿参数的AI大语言模型，可支持终端运行10亿、70亿、130亿、最高可达330亿参数的AI大语言模型。
天玑9300的发布标志着联发科进一步巩固了其在5G和AI领域的领先地位。这款芯片将为用户提供更快速、更高效的5G体验，同时也将为AI应用的发展提供更多的可能性。
新闻翻译：
Title: MediaTek launches天玑9300, the latest 5G full-load AI mobile chip
Keywords: MediaTek,天玑9300, 5G, full-load AI
News content:
MediaTek today released its latest天玑9300 flagship 5G full-load AI mobile chip. The chip adopts a full-load design with a 4-large core, with a maximum AI language model of 330 billion parameters, which can support terminal operations of 10 billion, 70 billion, 130 billion, and up to 330 billion parameters of AI language models.
The launch of天玑9300 further solidifies MediaTek’s leading position in the 5G and AI fields. This chip will provide users with more rapid and efficient 5G experiences, while also providing more possibilities for AI application development.
【来源】https://news.mydrivers.com/1/944/944169.htm
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