深圳鲲云信息科技有限公司（以下简称「鲲云科技」）宣布完成数亿元C轮融资。此轮融资由普罗资本领投，鼎晖百孚、联通旗下联创基金、张科垚坤基金、钟楼金控集团跟投。本轮资金主要用于支持下一代可重构数据流CAISA AI芯片的研发和规模落地，构建CAISA芯片在各垂直行业的产业化生态。
成立于2018年的鲲云科技是一家专注于AI芯片研发和生产的公司。公司致力于提供高性能、高可靠性的AI芯片解决方案，以满足各行业对AI计算的需求。此次融资将加速鲲云科技的研发和规模落地，推动公司在AI芯片领域的领先地位。
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Title: AI Chip Company “KunYun Technology” Completes �� billion yuan C-round Financing, Accelerating Research and Scale-up
Keywords: AI chip, financing,普罗资本，鲲云科技
news content:
Shenzhen KunYun Information Technology Co., Ltd. (referred to as “KunYun Technology”) has announced the completion of a �� billion yuan C-round financing round. The round of financing was led by普罗资本, and was supported by DingHui Best Practices Fund,联通旗下联创基金,ZhangKuangYao Fund, and ZhongLuJinKong Group. The funds from this round will be used to support the research and development of the next-generation reconfigurable data flow CAISA AI chip and the scaling up of the CAISA chip in various industries.
KunYun Technology, established in 2018, is a company specializing in AI chip research and development. The company aims to provide high-performance and highly reliable AI chip solutions to meet the demand for AI computing in various industries. This round of financing will accelerate KunYun Technology’s research and scale-up, and promote the company’s leading position in the AI chip field.
【来源】https://www.36kr.com/p/2579176272078464
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