近日，TechInsights 拆解了苹果 iPhone 15 Pro，并发现了其使用了美光最新超高密度 D1β（D1b）LPDDR5 16 Gb DRAM 芯片。这是业内首次涉足 D1β。D1β DRAM 被誉为世界上最先进的 DRAM 工艺节点。TechInsights 表示，对更小、更快、更高效组件的追求，是科技行业的持续驱动力。而 D1β DRAM 芯片的与众不同之处不仅在于其先进的技术，还在于其更小的物理尺寸。美光在生产 D1β DRAM 芯片环节上，绕开了极紫外光刻（EUVL）。IT 之家注：EUVL 是内存制造商三星和 SK 海力士等竞争对手，在 DRAM 上所采用的技术，被视为将 DRAM 工艺缩小到 15 纳米以下水平的重要推动因素。美光公司在不使用 EUVL 技术的情况下，成功开发和制造了 D1z，D1α和现在的 D1β DRAM 芯片，这超出了人们的期望。
新闻翻译：
Title: Apple’s iPhone 15 Pro uses Taiwan’s Wistron D1β LPDDR5 DRAM chip, leading the tech industry with D1β DRAM process node
Keywords: Apple, Wistron, D1β, DRAM, process node
News content:
Recently, TechInsights has analyzed the iPhone 15 Pro, and found that it uses the latest high-density D1β (D1b) LPDDR5 16 Gb DRAM chip from Taiwan’s Wistron. This is the first time the industry has 涉足 D1β. D1β DRAM is regarded as the most advanced DRAM process node in the world. TechInsights said that the pursuit of smaller, faster, and more efficient components is a continuous driving force in the technology industry. The uniqueness of the D1β DRAM chip is not only in its advanced technology but also in its smaller physical size. Wistron has successfully developed and manufactured D1z, D1α, and D1β DRAM chips without using EUVL technology, which is seen as an important factor in reducing DRAM technology to below 15 nanometers. Wistron has successfully developed and manufactured D1z, D1α, and D1β DRAM chips without using EUVL technology, which is seen as an important factor in reducing DRAM technology to below 15 nanometers. This exceeds people’s expectations.
【来源】https://www.ithome.com/0/721/910.htm
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