随着全球对计算能力的需求不断增长，半导体行业正面临着前所未有的挑战。为了应对这一挑战，芯片制造商正在探索各种新技术来提高芯片的性能。其中，一项名为直接混合键合（Hybrid Bonding）的技术引起了广泛的关注。
直接混合键合是一种将两个或多个芯片堆叠在一起的技术，可以构建所谓的3D芯片。这项技术可以显著提高芯片之间的连接密度，达到每平方毫米700万个连接点的水平。这对于满足日益增长的计算需求至关重要。尽管摩尔定律的限制使得晶体管尺寸的缩小速度放缓，但混合键合和其他先进封装技术提供了一种新的解决方案，通过堆叠芯片来增加处理能力和内存容量。
在今年的IEEE电子元件和技术会议上，来自世界各地的研究小组展示了混合键合技术的最新进展。英特尔的研究人员报告说，这种高密度的连接是实现更高性能计算所必需的。现在，系统技术协同优化（STCO）的概念正在主导半导体技术的发展，它允许芯片的不同部分分别使用最先进的工艺制造，然后通过混合键合和其他封装技术组装成完整的系统。
Yole Group的分析师Gabriella Pereira预测，到2029年，混合键合的市场规模将增长两倍以上，达到380亿美元。混合键合之所以受到重视，是因为它提供了最高密度的垂直连接，是目前先进封装行业增长最快的领域。
混合键合的实现过程包括在每个芯片的顶部建立铜垫，这些铜垫被绝缘层包围，绝缘层上略有凹陷。然后，将两个芯片面对面压在一起，使铜垫对齐，并通过缓慢加热使铜膨胀，从而形成电连接。这一过程需要精确的控制，以确保芯片之间的连接强度和稳定性。
总的来说，直接混合键合技术为半导体行业提供了一条新的路径，以应对摩尔定律的限制，并满足日益增长的计算需求。随着技术的不断进步，未来我们有望看到更多的创新和突破，推动计算能力的进一步提升。
英语如下：
News Title: “The Chip Revolution: Hybrid Bonding Technology to Double in Size to $38 Billion Market in Next Five Years”
Keywords: EUV Innovation, 3D Chips, Hybrid Bonding
News Content:
As global demand for computing power continues to grow, the semiconductor industry is facing unprecedented challenges. To meet these challenges, chip manufacturers are exploring various new technologies to enhance the performance of their chips. Among these, a technique known as direct hybrid bonding (Hybrid Bonding) has garnered widespread attention.
Direct hybrid bonding is a technology that stacks two or more chips together to construct so-called 3D chips. This technology significantly increases the interconnect density between chips, reaching a level of 700 million connections per square millimeter. This is crucial for meeting the ever-growing computing needs. Despite the limitations of Moore’s Law that slow down the rate of shrinking transistors, hybrid bonding and other advanced packaging technologies offer a new solution by stacking chips to increase processing power and memory capacity.
At this year’s IEEE International Electron Devices Meeting, research groups from around the world showcased the latest advancements in hybrid bonding technology. Intel researchers reported that such high-density connectivity is essential for achieving higher performance computing. Currently, the concept of System-in-Package technology (STCO) is leading the development of semiconductor technology, allowing different parts of a chip to be manufactured using the most advanced processes, and then assembled into complete systems through hybrid bonding and other packaging technologies.
Gabriella Pereira, an analyst at Yole Group, predicts that by 2029, the market size for hybrid bonding will grow more than twofold, reaching $38 billion. The importance of hybrid bonding lies in its provision of the highest density of vertical interconnects, making it the fastest-growing area in the advanced packaging industry.
The implementation of direct hybrid bonding involves establishing copper pads on the top of each chip, which are encased in an insulating layer with slight depressions. Then, the two chips are pressed together face-to-face, with the copper pads aligning, and a slow heating process is used to expand the copper, forming an electrical connection. This process requires precise control to ensure the strength and stability of the interconnections between chips.
In summary, direct hybrid bonding technology offers a new path for the semiconductor industry to overcome the limitations of Moore’s Law and meet the growing computing needs. As technology continues to advance, we can expect to see more innovations and breakthroughs that push the envelope of computing power even further.
【来源】https://www.jiqizhixin.com/articles/2024-08-12-5
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