**台积电创新AI芯片封装技术：采用矩形基板提高生产效率**
随着人工智能技术的飞速发展，计算需求急剧增长。为满足这一需求，全球领先的半导体制造商台积电正积极研究一种全新的先进芯片封装方法。据《日经亚洲》最新报道，台积电此次的创新集中在封装技术上，通过采用矩形基板替代传统的圆形晶圆。
这一新方法将改变现有的芯片封装方式。据悉，所使用的矩形基板尺寸为510毫米乘515毫米，不仅有效面积远超圆形晶圆，更使得每片基板上能够放置更多的芯片组。这一变革不仅能应对AI带来的计算需求激增，还能显著提高生产效率。与传统的圆形晶圆相比，矩形基板的边缘设计更为高效，减少了无效区域。
业内专家分析认为，台积电的这一创新技术将极大地推动人工智能领域的发展，有望在未来为数据中心和云计算市场带来革命性的变化。随着技术的不断进步，矩形基板的应用将更为广泛，带动整个半导体产业链的升级与发展。未来，我们期待台积电在这一领域带来更多令人瞩目的突破和创新。
英语如下：
News Title: TSMC’s Big Breakthrough: Rectangular Chip Packaging Technology Innovates the AI Industry
Keywords: TSMC explores AI chip packaging technology, rectangular substrate packaging, improving production efficiency
News Content: **TSMC Innovates AI Chip Packaging Technology: Adopting Rectangular Substrates to Improve Production Efficiency**
With the rapid development of artificial intelligence technology, the demand for computing has soared. To meet this demand, TSMC, a world-leading semiconductor manufacturer, is actively researching a new advanced chip packaging method. According to the latest report from Nikkei Asia, TSMC’s innovation focuses on packaging technology, adopting rectangular substrates instead of traditional circular wafers.
This new method will change the current chip packaging approach. It is reported that the rectangular substrates used have a size of 510mm by 515mm, with a larger effective area than circular wafers, allowing for more chipsets to be placed on each substrate. This transformation not only addresses the surge in computing demand brought by AI but also significantly improves production efficiency. Compared to circular wafers, the edge design of rectangular substrates is more efficient with fewer non-productive areas.
Industry experts analyze that TSMC’s innovative technology will greatly promote the development of the artificial intelligence field and is expected to bring revolutionary changes to the data center and cloud computing market in the future. With the continuous advancement of technology, the application of rectangular substrates will become more widespread, driving the upgrade and development of the entire semiconductor industry chain. In the future, we look forward to TSMC’s remarkable breakthroughs and innovations in this field.
【来源】https://wallstreetcn.com/articles/3717675
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