**SK海力士与台积电合作开发HBM4芯片 预期于2026年投产**
财联社报道，近日，内存芯片制造商SK海力士和全球知名的半导体制造公司台积电宣布，双方已签订谅解备忘录，合作开发第六代HBM产品（HBM4）。这一合作旨在整合HBM和逻辑层先进封装技术，旨在推动半导体行业的进一步革新。
据公告，两家公司将联手研发HBM4芯片，预期于2026年投产。这次合作不仅仅是在产品研发层面，更将涵盖生产技术优化和供应链协同。这对于当前市场对高性能计算和存储技术的需求增长而言，无疑是一场重要的技术合作。
随着科技的发展，HBM作为一种高带宽内存技术，已经成为高端计算市场的关键技术之一。此次合作所引发的技术创新及对未来生产能力的提升将对行业带来重大影响。面向未来的计算市场布局中，此项技术合作的深入将会给市场带来新的竞争格局和商业机遇。期待两家公司在未来推动更多创新技术问世，共同推动全球半导体行业的发展步伐。
英语如下：
News Title: “SK Hynix and TSMC Join Hands to Shape the Future: HBM4 Chip Production Expected in 2026”
Keywords: SK Hynix and TSMC Collaboration, HBM4 Chip Development, Production in 2026
News Content: **SK Hynix and TSMC Collaborate on HBM4 Chip Development, Expected to Be Produced in 2026**
According to reports from CFN, memory chip manufacturer SK Hynix and globally renowned semiconductor manufacturing company TSMC have announced their signing of a memorandum of understanding to collaborate on the development of the sixth-generation HBM product (HBM4). This collaboration aims to integrate HBM and advanced packaging technologies in the logic layer, aiming to further revolutionize the semiconductor industry.
According to the announcement, the two companies will jointly develop the HBM4 chip, with production expected in 2026. This collaboration extends not only to product development but also covers production technology optimization and supply chain coordination. This is undoubtedly an important technological collaboration in response to the current growth in demand for high-performance computing and storage technology.
With the development of technology, HBM, as a high-bandwidth memory technology, has become one of the key technologies in the high-end computing market. The technological innovation and future production capacity enhancement brought about by this collaboration will have significant impacts on the industry. In the layout of the future computing market, this deep technical collaboration will bring new competitive landscapes and business opportunities to the market. Looking forward, we expect both companies to drive the emergence of more innovative technologies in the future and jointly propel the development of the global semiconductor industry.
【来源】https://www.cls.cn/detail/1652041
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