三星电子与AMD公司近日签署了一项价值4万亿韩元（约合人民币210.8亿元）的合同，涉及高端内存技术HBM3E的供应。根据韩媒Bridge Economy的报道，这项合同标志着双方在先进技术领域的深入合作。
根据合同条款，AMD将采购三星生产的HBM3E内存，而三星则将购买AMD的AI加速卡。虽然目前尚不清楚具体的换购数量，但这一合作无疑将促进双方在人工智能领域的竞争优势。
三星表示，预计将于今年上半年开始量产HBM3E12H内存，而AMD预计将在下半年开始量产相关的AI加速卡。这一合作预计将有助于提升AMD在高端计算市场中的竞争力，同时也将为三星带来新的增长点。
HBM3E内存技术是三星最新的高端内存产品，它采用了先进的12层堆叠技术，相比前代产品具有更高的带宽和更低的功耗。这项技术被认为是未来高性能计算和人工智能应用的关键技术之一。
此次合作不仅展现了三星和AMD在技术创新上的决心，也预示着两家公司将在全球科技竞争中扮演更加重要的角色。随着人工智能和高性能计算需求的不断增长，这一合作有望为双方带来长期的市场优势。
英语如下：
Title: “Samsung Electronics and AMD Team Up for a 4 Trillion KRW HBM3E Deal”
Keywords: Samsung Electronics, AMD, HBM3E, AI Acceleration Cards
News Content:
Samsung Electronics and AMD have recently signed a contract worth 4 trillion KRW (approximately 21.08 billion RMB) for the supply of high-bandwidth memory (HBM3E) technology. According to a report by South Korean media outlet Bridge Economy, this contract marks a deepened collaboration between the two companies in the field of advanced technology.
Under the terms of the agreement, AMD will purchase HBM3E memory from Samsung, while Samsung will acquire AI acceleration cards from AMD. While the exact volume of the exchange is not yet clear, this partnership is expected to bolster both companies’ competitive advantages in the field of artificial intelligence.
Samsung expects to begin mass production of the HBM3E 12H memory in the first half of this year, while AMD plans to start production of the related AI acceleration cards in the second half. This collaboration is anticipated to help enhance AMD’s competitiveness in the high-end computing market and also provide Samsung with a new growth area.
HBM3E memory technology is Samsung’s latest high-end memory product, which utilizes an advanced 12-layer stacking technology, offering higher bandwidth and lower power consumption compared to its predecessor. This technology is considered a key technology for future high-performance computing and artificial intelligence applications.
This partnership not only demonstrates Samsung and AMD’s determination in technological innovation but also hints at the two companies’ increased roles in global technological competition. With the continuous growth in demand for artificial intelligence and high-performance computing, this collaboration is expected to bring long-term market advantages to both parties.
【来源】https://www.ithome.com/0/763/856.htm
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