近日，据业内人士透露，三星电子成功获得了一批英伟达AI芯片的2.5D封装订单，并已开始批量生产。这一消息表明，在全球半导体市场竞争日益激烈的背景下，三星在封装领域的影响力正逐渐扩大。
据悉，2.5D封装技术是一种介于传统的2D封装和3D封装之间的技术，能够在一定程度上提高芯片的性能和功耗表现。英伟达作为全球知名的显卡和AI芯片制造商，其选择三星作为2.5D封装订单的合作伙伴，无疑是对三星半导体封装技术的一种认可。
同时，韩媒预计，日前我国台湾地区发生的地震可能会进一步影响台积电CoWoS（嵌入式封装技术）的产能。CoWoS技术是一种将处理器与其他组件集成在同一封装中的技术，广泛应用于高性能计算和AI领域。受此影响，三星对于英伟达的2.5D封装订单有望进一步增加。
在全球半导体产业链中，我国台湾地区扮演着重要的角色，其地震对全球半导体产业链造成了不小的冲击。而三星在此时获得英伟达的2.5D封装订单，不仅有利于提升其市场竞争力，还可能对全球半导体产业的格局产生一定影响。
综上所述，三星获得英伟达AI芯片2.5D封装订单，进一步增加或将受我国台湾地区地震影响，这一消息充分展示了三星在半导体封装领域的实力，同时也反映了全球半导体产业竞争的激烈程度。
英语如下：
**Title: Samsung Secures Large Order for NVIDIA AI Chips with 2.5D Packaging, Business to Grow**
Keywords: Samsung, NVIDIA, 2.5D Packaging
**News Content:**
#### Samsung Secures Large Order for NVIDIA AI Chips with 2.5D Packaging, Potential Impact from Taiwan Earthquake
Recently, industry insiders revealed that Samsung Electronics has successfully secured a significant order for 2.5D packaging of NVIDIA AI chips and has commenced mass production. This development signifies that Samsung’s influence in the packaging field is expanding amidst the intensifying global semiconductor market competition.
It is understood that 2.5D packaging technology, which falls between traditional 2D packaging and 3D packaging, can enhance chip performance and power efficiency to a certain extent. As a globally renowned manufacturer of graphics cards and AI chips, NVIDIA’s choice of Samsung as a partner for 2.5D packaging orders is undoubtedly a recognition of Samsung’s semiconductor packaging technology.
Meanwhile, South Korean media predicts that the recent earthquake in Taiwan, China, may further impact the production capacity of TSMC’s CoWoS (Chip-on-Wafer-on-Substrate) technology. CoWoS is a technology that integrates processors with other components in the same package, widely used in high-performance computing and AI fields. Influenced by this, Samsung’s order for 2.5D packaging of NVIDIA chips is expected to further increase.
In the global semiconductor supply chain, Taiwan plays a crucial role, and the earthquake has caused significant disruption. Samsung’s securing of NVIDIA’s 2.5D packaging order at this time not only benefits its market competitiveness but may also have a certain impact on the global semiconductor industry structure.
In summary, Samsung’s securing of the NVIDIA AI chip 2.5D packaging order and the potential increase influenced by the earthquake in Taiwan reflect Samsung’s strength in the semiconductor packaging field and also demonstrate the fierce competition in the global semiconductor industry.
【来源】https://www.chinastarmarket.cn/detail/1639204
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