在2024年国际固态电路会议（ISSCC）上，全球领先的半导体制造商台积电披露了其最新的封装技术，这一创新技术专为高性能计算和人工智能（AI）芯片设计。在2月18日至22日的会议期间，台积电展示了其在3D封装技术上的新突破，此次升级整合了硅光子技术，以优化芯片间的互联性能并降低功耗。
台积电业务开发资深副总裁张晓强详细阐述了这项新技术，指出其目标在于提升AI芯片的性能。通过整合硅光子技术，台积电的新封装方案能够更有效地封装更多的高带宽内存（HBM）和Chiplet小芯片。这一进步不仅将增强芯片的计算能力，还能在保持高性能的同时，减少能源消耗，为未来的数据中心和AI应用提供更为高效且节能的解决方案。
这一创新标志着台积电在半导体封装技术领域的又一次飞跃，预示着高性能计算和AI芯片的性能将得到显著提升，同时也为应对日益增长的数据处理需求提供了新的可能。台积电的这一举动再次证明了其在推动半导体技术发展方面的领导地位，以及对满足行业未来挑战的坚定承诺。
英语如下：
News Title: “TSMC Revolutionizes Packaging Technology: Integrating Silicon Photonics for a New Era of High-Performance AI Chips”
Keywords: TSMC, new packaging technology, AI chips
News Content: At the 2024 International Solid-State Circuits Conference (ISSCC), TSMC, the world’s leading semiconductor manufacturer, unveiled its latest packaging technology, specifically designed for high-performance computing and artificial intelligence (AI) chips. During the conference from February 18 to 22, TSMC demonstrated a breakthrough in its 3D packaging technology, integrating silicon photonics to optimize inter-chip connectivity and reduce power consumption.
Senior Vice President of Business Development at TSMC, Xiaoqiang Zhang, elaborated on the innovation, highlighting its aim to enhance AI chip performance. By incorporating silicon photonics, TSMC’s new packaging solution enables more efficient packaging of high-bandwidth memory (HBM) and Chiplet-based small chips. This advancement not only boosts the chips’ computational capabilities but also reduces energy consumption while maintaining high performance, offering a more efficient and energy-saving solution for future data centers and AI applications.
This innovation marks another leap forward for TSMC in semiconductor packaging technology and signals a significant performance boost for high-performance computing and AI chips. It also presents new possibilities for addressing the growing demands of data processing. TSMC’s move underscores its leadership position in driving semiconductor technology advancement and its steadfast commitment to meeting the industry’s future challenges.
【来源】https://www.cls.cn/detail/1601181
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