在2024年2月18日至22日举行的国际固态电路会议（ISSCC）上，全球半导体巨头台积电（TSMC）公开了其在高性能计算和人工智能（AI）芯片封装技术上的最新突破。这家业界领军企业展示了新一代的封装解决方案，该技术在现有3D封装技术的基础上，创新性地融入了硅光子技术，以优化芯片间的连接性能并降低功耗。
台积电业务开发资深副总裁张晓强在会议上详细阐述了这项新技术，强调其目标在于提升AI芯片的性能。通过整合更多的高带宽内存（HBM）和Chiplet小芯片，台积电的新型封装技术有望实现更高效的数据处理和计算能力，这对于应对日益增长的高性能计算需求和AI应用的复杂性至关重要。
硅光子技术的应用为芯片间的通信提供了高速、低延迟的光信号传输，这在处理大规模数据和复杂算法时能够显著提升性能。此外，该技术还能通过减少传统电子信号传输带来的能量损失，帮助降低整体功耗，实现更绿色、节能的计算环境。
台积电的这一创新举措再次彰显了其在半导体技术领域的领先地位，同时也预示着未来高性能计算和AI芯片设计将迈向一个新的高度。随着技术的不断发展，我们有理由期待更强大、更节能的AI解决方案即将问世，为云计算、大数据、人工智能等领域带来革命性的变革。
英语如下：
News Title: “TSMC’s Innovative Packaging Technology Integrates Silicon Photonics, Paving the Way for a New Era in High-Performance AI Chips”
Keywords: TSMC, new packaging technology, AI chips
News Content: At the International Solid-State Circuits Conference (ISSCC) held from February 18 to 22, 2024, global semiconductor giant TSMC (Taiwan Semiconductor Manufacturing Company) showcased its latest breakthroughs in high-performance computing and artificial intelligence (AI) chip packaging technology. The industry leader presented a new generation of packaging solutions, which innovatively incorporate silicon photonics to enhance inter-chip connectivity performance and reduce power consumption, building upon existing 3D packaging technologies.
Senior Vice President of Business Development at TSMC, Xiaojun Zhang, elaborated on the innovation during the conference, emphasizing its focus on boosting AI chip performance. By integrating more High-Bandwidth Memory (HBM) and Chiplet-based small chips, TSMC’s novel packaging technology aims to enable more efficient data processing and computational capabilities, a critical aspect in addressing the growing demands of high-performance computing and the complexity of AI applications.
The application of silicon photonics facilitates high-speed, low-latency optical signal transmission between chips, significantly enhancing performance, especially when dealing with large-scale data and complex algorithms. Moreover, this technology reduces energy loss associated with traditional electronic signal transmission, contributing to a more energy-efficient and eco-friendly computing environment.
TSMC’s innovative move underscores its leadership in semiconductor technology and foreshadows a new milestone in the design of high-performance computing and AI chips. As technology continues to evolve, we can anticipate the emergence of more powerful and energy-efficient AI solutions that will bring revolutionary changes to the fields of cloud computing, big data, and artificial intelligence.
【来源】https://www.cls.cn/detail/1601181
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