三星电子在今日的股东大会上宣布，其DS部门正积极推进AI芯片的创新进程，计划于今年底至明年初推出全新的AI芯片Mach-1。这款芯片的一大特点是采用了LPDDR内存，而非传统的HBM内存，这在业界可谓是一次独特尝试。
据三星电子DS部门负责人庆桂显透露，Mach-1芯片目前已经完成了基于FPGA的技术验证阶段，目前正处于关键的SoC设计阶段。他强调，这款AI芯片旨在打造一个轻量级的解决方案，因此选择了更为经济且实用的LPDDR内存，而不是市场上供不应求且价格较高的HBM内存。
庆桂显表示，Mach-1芯片的制造过程预计将于今年底完成，随后在明年初，三星将推出基于这款AI芯片的完整AI系统。这一举措表明三星在AI领域的战略布局，旨在提供更加高效、成本优化的AI处理能力，以满足不断增长的市场需求。
这一决策不仅显示了三星在技术创新上的决心，也预示着AI芯片市场可能将迎来新的竞争格局。随着Mach-1芯片的推出，三星有望在轻量级AI芯片领域开辟新的市场空间，进一步巩固其在全球半导体行业的领导地位。
英语如下：
**News Title:** “Samsung Electronics Set to Launch AI Chip Mach-1 with LPDDR Memory: Expected by Year’s End”
**Keywords:** Samsung AI chip, Mach-1, LPDDR memory
**News Content:** Samsung Electronics announced at its shareholders’ meeting today that its DS division is actively driving innovation in AI chips, with plans to unveil the new AI chip, Mach-1, by the end of this year or early next year. A standout feature of this chip is its adoption of LPDDR memory, marking a unique departure from the conventional HBM memory.
According to Kyung Kye-hyun, the head of Samsung Electronics’ DS division, the Mach-1 chip has completed the FPGA-based technology verification phase and is currently in the crucial SoC design stage. He emphasized that the AI chip is designed to offer a lightweight solution, hence the choice of more cost-effective and practical LPDDR memory over the high-priced and in-demand HBM memory.
Kyung Kye-hyun revealed that the manufacturing process for the Mach-1 chip is expected to conclude by the end of this year, followed by the launch of a complete AI system based on this chip early next year. This move underscores Samsung’s strategic positioning in the AI domain, aiming to provide more efficient and cost-optimized AI processing capabilities to cater to the growing market demand.
This decision not only demonstrates Samsung’s commitment to technological innovation but also foreshadows a potential shift in the AI chip market landscape. With the introduction of the Mach-1 chip, Samsung is poised to carve out a new niche in the lightweight AI chip segment, further solidifying its leading position in the global semiconductor industry.
【来源】https://www.ithome.com/0/756/978.htm
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