Customize Consent Preferences

We use cookies to help you navigate efficiently and perform certain functions. You will find detailed information about all cookies under each consent category below.

The cookies that are categorized as "Necessary" are stored on your browser as they are essential for enabling the basic functionalities of the site. ... 

Always Active

Necessary cookies are required to enable the basic features of this site, such as providing secure log-in or adjusting your consent preferences. These cookies do not store any personally identifiable data.

No cookies to display.

Functional cookies help perform certain functionalities like sharing the content of the website on social media platforms, collecting feedback, and other third-party features.

No cookies to display.

Analytical cookies are used to understand how visitors interact with the website. These cookies help provide information on metrics such as the number of visitors, bounce rate, traffic source, etc.

No cookies to display.

Performance cookies are used to understand and analyze the key performance indexes of the website which helps in delivering a better user experience for the visitors.

No cookies to display.

Advertisement cookies are used to provide visitors with customized advertisements based on the pages you visited previously and to analyze the effectiveness of the ad campaigns.

No cookies to display.

0

【明日GTC 2024大会上,英伟达或将揭晓Blackwell GPU新架构】据可靠消息,全球知名图形处理器制造商英伟达(Nvidia)将在明日的GTC 2024(GPU Technology Conference)主题演讲中,由公司创始人黄仁勋亲自宣布下一代GPU架构——Blackwell。此次发布会备受期待,尤其是爆料者XpeaGPU揭示了Blackwell架构的部分关键细节。

据XpeaGPU透露,即将发布的B100 GPU将搭载两个基于台积电(TSMC)CoWoS-L封装技术的计算芯片。CoWoS技术是一种先进的2.5D封装工艺,通过堆叠芯片以提升处理能力,同时实现更紧凑的尺寸和更低的能耗。B100 GPU将配备8个8-Hi HBM3e高带宽内存堆栈,总计容量高达192GB,这一配置与AMD的Instinct MI300 GPU的192GB相同。

此外,XpeaGPU还暗示了一个更高级的版本,代号为B200的Blackwell GPU更新,它将利用12-Hi设计以实现更大的内存容量,达到288GB。尽管尚未确认是HBM3e还是HBM4技术,但这一提升无疑将为高性能计算和专业应用领域带来显著的性能飞跃。

明日的GTC 2024主题演讲将揭示更多关于英伟达Blackwell GPU架构的详细信息,全球科技爱好者和行业专家都在拭目以待,以了解这一新架构将如何重塑高性能计算的未来。来源:IT之家。

英语如下:

**News Title:** “NVIDIA GTC 2024 Preview: Jensen Huang May Unveil Blackwell GPU with Record-Breaking 288GB VRAM!”

**Keywords:** NVIDIA GPU, Blackwell, HBM3e VRAM

**News Content:** At tomorrow’s GPU Technology Conference 2024 (GTC 2024), NVIDIA, the renowned graphics processing unit (GPU) manufacturer, is expected to reveal its next-generation GPU architecture, Blackwell, during the keynote address by the company’s founder, Jensen Huang. The event is highly anticipated, particularly after leaks from insider XpeaGPU disclosed crucial details about the Blackwell architecture.

According to XpeaGPU, the upcoming B100 GPU will feature two compute chips based on TSMC’s CoWoS-L packaging technology. CoWoS (Chip-on-Wafer-on-Substrate) is an advanced 2.5D packaging method that enhances processing power while maintaining a compact size and reducing power consumption. The B100 GPU will boast eight 8-Hi HBM3e high-bandwidth memory stacks, amounting to a total capacity of 192GB, matching AMD’s Instinct MI300 GPU’s 192GB.

Additionally, XpeaGPU hints at an even more advanced variant, the B200 Blackwell GPU update, which would leverage a 12-Hi design to accommodate a larger memory capacity of 288GB. While it’s unconfirmed whether it will utilize HBM3e or HBM4 technology, this upgrade promises a significant performance leap for high-performance computing and professional applications.

Tomorrow’s GTC 2024 keynote will shed more light on the specifics of NVIDIA’s Blackwell GPU architecture, with tech enthusiasts and industry experts worldwide eagerly awaiting insights into how this new architecture will reshape the future of high-performance computing. Source: IT Home.

【来源】https://www.ithome.com/0/756/310.htm

Views: 6

0

发表回复

您的邮箱地址不会被公开。 必填项已用 * 标注