【OpenAI CEO访韩，或将与SK集团、三星电子探讨AI芯片领域合作】据IT之家报道，OpenAI的首席执行官Sam Altman本周将踏上韩国首尔的行程，此行的重头戏是他可能与SK集团的会长崔泰源进行会晤，双方或将就人工智能芯片领域的合作展开深入讨论。这一消息在业界引发了广泛关注，鉴于OpenAI在人工智能技术领域的领先地位，以及SK集团在半导体行业的实力，双方的合作或将催生出新的技术创新。
同时，也有业内猜测，Altman在韩国的访问可能不仅仅局限于SK集团。有传言指出，他可能会与韩国电子巨头三星电子进行接触，讨论关于代工生产和高带宽内存（HBM）的合作可能性。三星电子在全球半导体代工市场占有重要份额，且在HBM技术上拥有显著优势，这使得双方的合作前景同样备受期待。
此次Sam Altman的韩国之行，无疑凸显了全球科技巨头在AI芯片领域的竞争与合作态势。随着AI技术的快速发展，高性能芯片的需求日益增长，OpenAI与韩国企业的潜在合作，可能会为全球AI芯片市场带来新的格局变化。
英语如下：
**News Title:** “OpenAI CEO Sam Altman’s Visit to South Korea Sparks Rumors of AI Chip Collaborations with SK and Samsung”
**Keywords:** OpenAI visit to South Korea, SK chip partnership, Samsung manufacturing discussions
**News Content:** According to IT Home, OpenAI’s CEO, Sam Altman, is set to embark on a trip to Seoul this week, with a key highlight being a potential meeting with SK Group Chairman Chey Tae-won. The two are rumored to engage in in-depth discussions about collaboration in the AI chip sector. This development has attracted widespread attention in the industry, given OpenAI’s leading position in AI technology and SK Group’s prowess in the semiconductor industry. A partnership between the two could potentially spark new innovations.
Simultaneously, there are speculations that Altman’s visit may not be exclusive to SK Group. It is whispered that he might also meet with South Korean electronics giant Samsung Electronics to explore cooperation possibilities in contract manufacturing and High-Bandwidth Memory (HBM). Samsung Electronics holds a significant share in the global semiconductor foundry market and possesses notable advantages in HBM technology, making their potential collaboration equally anticipated.
Altman’s visit to South Korea underscores the competitive and collaborative landscape among global tech giants in the AI chip domain. As AI technology accelerates, the demand for high-performance chips is on the rise. OpenAI’s potential collaborations with Korean companies might reshape the global AI chip market dynamics.
【来源】https://www.ithome.com/0/746/493.htm
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