**台积电在ISSCC 2024上发布创新封装技术，融合硅光子技术提升AI芯片性能**
在2月18日至22日举办的国际固态电路会议（ISSCC 2024）上，全球领先的半导体制造商台积电（TSMC）向业界展示了其用于高性能计算和人工智能（AI）芯片的最新一代封装技术。这项技术创新性地在现有的3D封装技术基础上，整合了硅光子技术，以优化芯片间的互联性能并降低功耗。
台积电业务开发资深副总裁张晓强详细阐述了这项新技术的应用前景，他表示，通过这项技术，可以更有效地封装更多的高带宽内存（HBM）和Chiplet小芯片，从而显著提升AI芯片的运算速度和能效。硅光子技术的引入，使得数据传输速度和效率得到大幅提升，为高性能计算和AI应用带来了革命性的进步。
台积电的这一突破性进展再次证明了其在半导体领域的领先地位，也预示着未来AI和高性能计算领域的芯片设计将进入一个全新的时代。随着技术的不断发展，这种创新封装解决方案有望为数据中心、云计算、自动驾驶等高需求领域提供更强大、更节能的计算能力。
英语如下：
News Title: “TSMC Innovates Packaging Technology: Integrating Silicon Photonics for a New Era of High-Performance AI Chips”
Keywords: TSMC, new packaging technology, AI chips
News Content: **TSMC Unveils Innovative Packaging Tech at ISSCC 2024, Leveraging Silicon Photonics to Boost AI Chip Performance**
At the International Solid-State Circuits Conference (ISSCC) held from February 18 to 22, 2024, TSMC (Taiwan Semiconductor Manufacturing Company), a global leader in semiconductor manufacturing, showcased its latest generation of packaging technology designed for high-performance computing and artificial intelligence (AI) chips. This innovation builds upon existing 3D packaging techniques, integrating silicon photonics to optimize inter-chip connectivity and reduce power consumption.
Senior Vice President of Business Development at TSMC, Xiaojun Zhang, elaborated on the technology’s potential, stating that it enables more efficient packaging of high-bandwidth memory (HBM) and Chiplet dies, significantly enhancing the speed and energy efficiency of AI chips. The introduction of silicon photonics results in substantial improvements in data transfer speed and efficiency, ushering in a revolutionary advancement for high-performance computing and AI applications.
TSMC’s breakthrough underscores its leading position in the semiconductor industry and foreshadows a new era in chip design for AI and high-performance computing. As technology progresses, this innovative packaging solution is expected to provide more powerful and energy-efficient computing capabilities for data centers, cloud computing, autonomous driving, and other high-demand sectors.
【来源】https://www.cls.cn/detail/1601181
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