明日，全球瞩目的图形处理巨头英伟达将在GTC 2024大会上揭开其下一代GPU架构——Blackwell的神秘面纱。据业内爆料达人XpeaGPU透露，本次发布的B100 GPU将搭载台积电先进的CoWoS-L封装技术，以两个计算芯片的堆叠设计，实现性能与效率的双重提升。这款GPU配备了8个8-Hi HBM3e显存堆栈，总计192GB的显存容量，与AMD的Instinct MI300 GPU在容量上并驾齐驱。
然而，英伟达似乎并未止步于此。XpeaGPU还暗示，一款代号为B200的Blackwell更新版本正在研发中，其显存容量将达到惊人的288GB。虽然具体是采用HBM3e还是更先进的HBM4技术尚未明确，但可以预见，这将再次刷新行业标准，为高性能计算和数据中心应用提供更为强大的支持。
明日的英伟达GTC 2024主题演讲，其创始人黄仁勋的宣布无疑将为全球科技界带来一场视觉与技术的盛宴。新一代Blackwell GPU的登场，预示着图形处理和高性能计算领域即将迎来新的里程碑。让我们共同期待这一创新技术如何重塑未来的计算格局。
英语如下：
News Title: “NVIDIA to Unveil Blackwell GPU Tomorrow: B100 with 192GB VRAM, B200 Might Push the Limit to 288GB!”
Keywords: NVIDIA GPU, Blackwell architecture, HBM3e VRAM
News Content: Tomorrow, the global graphics processing giant NVIDIA will lift the curtain on its next-generation GPU architecture, Blackwell, during the GTC 2024 conference. According to renowned leaker XpeaGPU, the B100 GPU to be launched will feature TSMC’s cutting-edge CoWoS-L packaging technology, stacking two compute chips for a boost in both performance and efficiency. This GPU is equipped with eight 8-Hi HBM3e VRAM stacks, aggregating to a massive 192GB VRAM, matching AMD’s Instinct MI300 GPU in capacity.
However, NVIDIA appears to be pushing boundaries even further. XpeaGPU hints at a B200 variant of the Blackwell in development, which could boast an astonishing 288GB VRAM. While it’s unclear whether it will utilize HBM3e or the more advanced HBM4 technology, this is set to redefine industry standards and provide even stronger support for high-performance computing and data center applications.
NVIDIA’s GTC 2024 keynote, led by its founder, Jensen Huang, promises to be a feast for the eyes and technology enthusiasts worldwide. The debut of the new Blackwell GPU signals a new milestone in graphics processing and high-performance computing. Let’s eagerly anticipate how this innovative technology will reshape the future of computational landscapes.
【来源】https://www.ithome.com/0/756/310.htm
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