英伟达即将在GTC 2024主题演讲上宣布其下一代GPU架构Blackwell，据消息透露，该架构下的B100 GPU将配备192GB HBM3e显存，而B200 GPU更将搭载288GB显存，实现容量翻倍。这两款GPU将采用台积电的CoWoS-L封装技术，该技术通过堆叠芯片提高处理能力，同时减少空间占用和功耗。B100 GPU将包含两个计算芯片，与8个8-Hi HBM3e显存堆栈相连，这与AMD在其Instinct MI300 GPU上采用的方案相同。关于B200 GPU，虽然爆料未明确是HBM3e还是HBM4，但其12-Hi技术将支持更高的显存容量。上述信息来源为IT之家。
英文翻译内容：
Title: NVIDIA reportedly set to launch B100 GPU with 192GB HBM3e memory, next-gen Blackwell architecture to double capacity
Keywords: NVIDIA, GPU, HBM3e, architecture
News content:
NVIDIA is set to announce its next-gen GPU architecture, Blackwell, at the GTC 2024 keynote, with the B100 GPU reportedly coming with 192GB of HBM3e memory and the B200 GPU boasting a capacity of 288GB, according to sources. Both GPUs will utilize TSMC’s CoWoS-L packaging technology, which increases processing power by stacking chips, reducing space and power consumption. The B100 GPU will feature two compute chips connected to eight 8-Hi HBM3e memory stacks, mirroring AMD’s approach on the Instinct MI300 GPU. The B200 GPU, while the leaker did not specify whether it will use HBM3e or HBM4, will leverage 12-Hi technology to support higher memory capacities. The information comes from IT Home.
【来源】https://www.ithome.com/0/756/310.htm
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