随着人工智能技术的迅猛发展，全球对高性能AI芯片的需求激增。作为全球领先的半导体代工企业，台积电（TSMC）宣布启动新一轮的“大扩产”计划。据科创板日报报道，台积电将投资建设十座先进的晶圆厂和封装厂，以满足客户对AI芯片的强烈需求。
此次扩产计划将于4月份正式启动，包括正在建设的2纳米晶圆厂和多个先进封装厂。台积电不仅将推进至更先进的1.4纳米和1纳米制程，还在考虑在台湾地区投资兴建8至10座1纳米制程的工厂。这些举措表明，台积电正致力于巩固其在全球半导体市场的领导地位，并确保能够满足未来几年内AI芯片市场的高速增长需求。
台积电的这一系列扩产行动，不仅将提升其生产能力，还将推动整个半导体产业链的发展，带动相关设备和材料供应商的业绩增长。同时，这也将有助于推动全球科技行业的发展，为人工智能、高性能计算、5G通信等前沿技术提供强大的硬件支持。
英文翻译内容：
Title: TSMC Launches Massive Expansion to Meet Soaring Demand for AI Chips
Keywords: TSMC, Expansion, AI Chips
News content:
In response to the skyrocketing demand for AI chips driven by the rapid advancement of artificial intelligence, TSMC, the world’s leading semiconductor foundry, has announced a significant expansion plan. According to a report by the Science and Technology Innovation Board Daily, TSMC will initiate the expansion by commencing the installation of equipment in ten advanced wafer fabrication and packaging plants in April.
The expansion plan includes the construction of additional 2-nanometer wafer plants and multiple advanced packaging facilities. TSMC is also planning to advance to even more sophisticated processes, such as 1.4-nanometer and 1-nanometer technologies. Additionally, the company is considering investing in the construction of 8 to 10 1-nanometer fabrication plants in Taiwan. These measures demonstrate TSMC’s commitment to solidify its leadership in the global semiconductor market and ensure its ability to cater to the expected high growth of the AI chip market in the coming years.
TSMC’s expansion initiatives will not only enhance its production capacity but also propel the development of the entire semiconductor supply chain, benefiting the performance of related equipment and material suppliers. Furthermore, this expansion will contribute to the advancement of the global technology industry, providing robust hardware support for cutting-edge technologies such as artificial intelligence, high-performance computing, and 5G communication.
【来源】https://www.chinastarmarket.cn/detail/1613609
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