英特尔公司近日在 IFS Direct Connect 大会上宣布了一项雄心勃勃的“10X moonshot”计划，旨在2027年底前投产 Intel 10A 工艺，并推出由协作机器人（Cobots）驱动的全人工智能自动化芯片制造工厂。这一消息在行业内引起了广泛关注，标志着英特尔在芯片制造领域的又一重大创新。
英特尔表示，将全面推行人工智能在芯片制造过程中的应用，从生产流程、产能规划、预测、产量改进到车间级生产操作，都将由人工智能和“Cobots”协作完成。这不仅提升了生产效率，还有望提高芯片生产的灵活性和准确性。
英特尔的全AI自动化芯片代工厂计划，无疑是该公司在技术革新上的又一重要里程碑。这一计划的实施，不仅将改变传统芯片制造行业的面貌，也将对整个科技行业产生深远的影响。
英文标题：Intel Unveils “10X moonshot” Plan for AI-driven, Cobot-assisted Semiconductor Fab
英文关键词：Intel, AI, automation, semiconductor
英文新闻内容：
Intel Corporation has recently announced at the IFS Direct Connect event its ambitious “10X moonshot” plan, aiming to bring Intel 10A process into production by the end of 2027 and introduce a fully AI-automated semiconductor fab powered by collaborative robots (Cobots). This news has garnered significant attention within the industry, marking another significant innovation by Intel in the field of chip manufacturing.
Intel states that it will fully implement AI in the application of semiconductor manufacturing processes, ranging from production flow, capacity planning, forecasting, yield improvement, to plant-level production operations, all of which will be completed collaboratively by AI and Cobots. This not only improves production efficiency but also promises to enhance the flexibility and accuracy of chip production.
Intel’s plan for a fully AI-automated semiconductor fab signifies another important milestone in the company’s technological innovation. The implementation of this plan is not only set to change the face of the traditional semiconductor manufacturing industry but also to have a profound impact on the tech industry as a whole.
【来源】https://www.ithome.com/0/752/814.htm
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