德国慕尼黑初创公司Semron近日成功筹集了730万欧元的种子资金，其突破性的3D AI芯片技术吸引了众多投资机构的关注。此轮融资由Join Capital领投，SquareOne、OTB Ventures、Hermann Hauser的Onsight Ventures和现有投资者参与。
Semron公司致力于改造智能设备的半导体技术，其3D AI芯片技术有望引领智能设备行业的革新。据悉，该技术将大幅提升智能设备的性能，降低能耗，为用户带来更为流畅的体验。
作为一家具有前瞻性的初创公司，Semron的成功融资将进一步推动其在AI芯片领域的研发工作。此次融资将助力Semron加快技术成熟，推动产业升级，为全球智能设备市场注入新的活力。
英文标题：German Semron Raises €7.3 Million in Seed Funding for Breakthrough 3D AI Chip Technology
关键词：AI chip, financing, technological innovation
新闻内容：
German semiconductor startup Semron has recently successfully raised €7.3 million in seed funding, with its groundbreaking 3D AI chip technology drawing the attention of many investment institutions. This round of financing was led by Join Capital, with participation from SquareOne, OTB Ventures, Hermann Hauser’s Onsight Ventures, and existing investors.
Semron, headquartered in Munich, Germany, is dedicated to transforming semiconductor technology for smart devices. Its 3D AI chip technology is expected to lead the innovation in the smart device industry. It is reported that this technology will significantly improve the performance of smart devices while reducing energy consumption, bringing a more seamless experience to users.
As a forward-looking startup, Semron’s successful fundraising will further promote its research and development in the field of AI chip technology. This round of financing will help Semron accelerate the maturity of its technology, promote industrial upgrading, and inject new vitality into the global smart device market.
【来源】https://venturebeat.com/ai/semron-raises-7-9m-for-ai-chips-with-3d-packaging/
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