在达沃斯论坛上，英特尔首席执行官帕特·基辛格表示，受美国、日本、荷兰联合实施的出口管制环境影响，中国与全球顶尖芯片技术存在约10年的差距。基辛格强调，这一差距正是美国在全球范围内建立的政策所预示的。他同时指出，为了保持美国的出口和竞争力，英特尔正在努力确保未来十年内，半数芯片在美国制造。这一预测和目标，无疑给全球芯片产业，尤其是中国的芯片产业，带来了巨大的挑战和压力。
Title: Intel CEO Predicts: China’s Chip Technology Lags Behind the U.S. by a Decade, with Half of Global Chips to be Manufactured in the U.S.
Keywords: Intel, CEO, Chip Gap
News content:
At the World Economic Forum, Intel CEO Pat Gelsinger stated that due to the export control environment implemented jointly by the United States, Japan, and the Netherlands, China is about 10 years behind the world’s top chip technology. Gelsinger emphasized that this gap is exactly what the U.S. policy established globally predicts. He also pointed out that to maintain U.S. export and competitiveness, Intel is working to ensure that half of the chips are manufactured in the U.S. over the next decade. This prediction and goal undoubtedly bring巨大的挑战和压力to the global chip industry, especially to China’s chip industry.
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