全球内存芯片制造商SK海力士正加大投资力度，积极扩大其HBM（高带宽内存）的产能，以满足高性能AI产品日益增长的需求。据悉，SK海力士计划将HBM的产能增加一倍以上，为此，公司将加大对硅通孔（TSV）相关设施的投资，预计2024年上半年开始生产第五代高带宽内存产品HBM3E。
随着人工智能技术的快速发展，对于高性能内存的需求也在不断攀升。HBM内存因其高性能、低延迟的特点，被广泛应用于AI领域。SK海力士此举，无疑是对未来AI市场的一份重要押注。
英文标题：SK Hynix Bets on AI Market, Doubling HBM Production
英文关键词：SK Hynix, HBM, AI
英文新闻内容：
Global memory chip manufacturer SK Hynix is stepping up its investment to actively expand its HBM (High Bandwidth Memory) production capacity to meet the growing demand for high-performance AI products. It is reported that SK Hynix plans to increase HBM production capacity by more than onefold. For this purpose, the company will increase its investment in through-silicon via (TSV) related facilities by more than onefold compared to 2023 and plans to start producing its fifth-generation high-bandwidth memory product HBM3E in the first half of 2024.
With the rapid development of artificial intelligence technology, the demand for high-performance memory is also increasing. HBM memory is widely used in the AI field due to its high performance and low latency. SK Hynix’s move is undoubtedly an important bet on the future AI market.
【来源】https://wallstreetcn.com/articles/3707318
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