德国慕尼黑初创公司Semron近日完成了730万欧元的种子轮融资，该公司致力于突破性的3D AI芯片技术研发，以革新智能设备的半导体领域。本轮融资由Join Capital领投，SquareOne、OTB Ventures、Hermann Hauser的Onsight Ventures以及现有投资者参与。
Semron的3D AI芯片技术有望在智能设备性能提升、能耗降低等方面发挥关键作用。据悉，该公司计划利用这笔资金加速产品研发和市场拓展，以期在未来几年内实现技术商业化。
近年来，随着人工智能技术的飞速发展，AI芯片市场也成为各大企业和初创公司竞相追逐的焦点。Semron的成功融资将进一步推动全球AI芯片产业的创新与发展。
英文标题：German Semron Secures €7.3 Million in Seed Funding for Breakthrough 3D AI Chip Technology
英文关键词：AI chip, funding, technological innovation
英文新闻内容：
German semiconductor startup Semron has recently completed a €7.3 million seed round of financing, aiming to transform the semiconductor field for smart devices with its groundbreaking 3D AI chip technology. This round of financing was led by Join Capital, with participation from SquareOne, OTB Ventures, Onsight Ventures of Hermann Hauser, and existing investors.
Semron’s 3D AI chip technology is expected to play a key role in improving the performance and reducing energy consumption of smart devices. It is reported that the company plans to use the funds to accelerate product research and development and market expansion, with the goal of commercializing the technology in the next few years.
In recent years, with the rapid development of artificial intelligence technology, the AI chip market has become a focus of competition for major enterprises and startups around the world. Semron’s successful financing will further promote innovation and development in the global AI chip industry.
【来源】https://venturebeat.com/ai/semron-raises-7-9m-for-ai-chips-with-3d-packaging/
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