近日，总部位于德国科技重镇慕尼黑的创新型人工智能芯片创业企业Semron成功宣布完成了一轮790万美元（折合约730万欧元）的种子轮融资。这家专注于研发突破性3D AI芯片技术的初创公司在新一代智能设备半导体革新领域取得了重大进展，其技术将有望重塑现有电子产品的智能化水平。
此次融资由知名风险投资机构Join Capital领投， SquareOne、OTB Ventures、著名投资人Hermann Hauser创办的Onsight Ventures以及现有投资者共同参与，显示出全球科技界对Semron前瞻性技术研发的高度认可与期待。Semron的3D AI芯片技术凭借其在处理复杂数据、提升计算效率及优化能效方面的显著优势，将为各类智能设备如智能手机、物联网(IoT)产品、自动驾驶汽车等提供更为强大且高效的核心算力支持。
Semron创始人及CEO表示，这笔资金将进一步加速公司在产品研发、人才引进及市场拓展等方面的步伐，以期早日实现3D AI芯片的大规模商业化应用，推动全球范围内的数字化转型进程。业界普遍认为，Semron的成功融资不仅预示着该公司在未来AI芯片市场竞争中的重要地位，也将助力打造一个更加智慧互联的未来世界。
英语如下：
Headline: “German Semron Raises $7.9 Million in Seed Funding, Revolutionizing the Era of Intelligent Devices with 3D AI Chips!”
Keywords: Semron, 3D AI chip, seed funding
News Content: Recently, innovative artificial intelligence chip startup Semron, based in Munich, Germany’s tech hub, has successfully announced the completion of a seed round financing worth $7.9 million (equivalent to approximately €7.3 million). This pioneering company, specializing in developing breakthrough 3D AI chip technology, has made significant strides in redefining semiconductor innovation for the next-generation of smart devices. Its technology promises to reshape the level of intelligence in existing electronic products.
The round was led by renowned venture capital firm Join Capital, with participation from SquareOne, OTB Ventures, and Onsight Ventures co-founded by esteemed investor Hermann Hauser, as well as existing investors. This demonstrates the high recognition and anticipation from the global tech community for Semron’s前瞻性的 research and development of its 3D AI chip technology. The technology boasts outstanding advantages in processing complex data, enhancing computational efficiency, and optimizing energy efficiency, providing powerful and efficient core computing capabilities for various intelligent devices such as smartphones, IoT products, autonomous vehicles, and more.
Semron’s founder and CEO stated that this funding will further accelerate the company’s progress in product development, talent acquisition, and market expansion, aiming to expedite the large-scale commercial application of 3D AI chips and drive the global digital transformation process. Industry experts普遍 view Semron’s successful fundraising not only as an indication of its future importance in the AI chip market competition but also as a catalyst for fostering a more智慧互联 future world.
【来源】https://venturebeat.com/ai/semron-raises-7-9m-for-ai-chips-with-3d-packaging/
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