标题：ROG BTF 2.0 背置全家桶亮相，接口背插设计引领主板新潮流
在今日晚间的 ROG 2024 新品发布会上，ROG BTF 2.0 背置全家桶正式亮相，这一全新的接口背插设计主板即将投入市场。据介绍，ROG BTF 2.0 背置全家桶包括三款产品，分别是 ROG MAXIMUS Z790 HERO BTF 背置主板、ROG STRIX RTX4090D BTF 背置显卡以及 ROG HYPERION 创世神 BTF 背置机箱。
ROG BTF 2.0 背置全家桶的最大亮点在于其接口背插设计，大量接口与接针被移至主板背面，大大降低了理线的难度。同时，该系列主板还取消了显卡正面的外接供电设计，通过主板上的背置显卡供电插槽搭配上 BTF 2.0 显卡背置供电金手指，即可为显卡供电。
此外，ROG BTF 2.0 背置全家桶主板还具备全覆盖散热装甲，IO 装甲上配有 Polymo 动态灯效，呈现两种不同的图案。参数方面，该主板拥有强大的供电模组，支持 DDR5 内存，可稳定最高 DDR5-8000（OC）频率以上，还有 AI 智能超频、AI 智能散热 2.0、双向 AI 降噪和 AI 智能网络等功能。
值得一提的是，ROG BTF 2.0 背置全家桶采用全新的显卡易拆装设计，无需按下解锁按钮，只需将显卡从挡板一侧拔起，就能将其从插槽中取出。而 Q-LED 故障诊断灯也能快速判断主板接线问题，甚至可在开机前判断内存是否正确安装。
接口方面，该主板板载 5 个 M.2 接口，其中一个支持 PCIe 5.0；还有双雷电 4 Type-C 接口，传输速度最高 40Gbps；搭载 2.5G 有线网卡 + WiFi 7 无线网卡，以及即插即用的易拆式天线。
据悉，ROG MAXIMUS Z790 HERO BTF 背置主板将在后续发售，但目前暂未查询到价格信息。无论如何，ROG BTF 2.0 背置全家桶的出现无疑将为主板市场带来一场革新，引领新的潮流。
英语如下：
Title: “Introducing the All-New ROG BTF 2.0 Back-Mounted Bundle: Revolutionary Interface and Enhanced Cooling!”
Keywords: 1. ROG BTF 2.0 Back-Mounted Motherboard
Content:
Title: Introducing the All-New ROG BTF 2.0 Back-Mounted Bundle, Revolutionizing Motherboard Design with its Back-Plug Design
At tonight’s ROG 2024 product launch event, the highly anticipated ROG BTF 2.0 Back-Mounted Bundle was officially unveiled, set to hit the market soon. The new series of motherboards features a back-plug design with a large number of interfaces and pins moved to the back of the board, significantly simplifying cable management. Additionally, this series of boards eliminates the external power supply design from the front of the graphics card, allowing for efficient power delivery through the back-mounted graphics card power slot and BTF 2.0 graphics card back-mounted power pins.
The ROG BTF 2.0 Back-Mounted Bundle stands out with its full coverage cooling armor, featuring Polymo dynamic lighting on the IO armor that presents two different patterns. In terms of specifications, this motherboard boasts powerful power modules, supports DDR5 memory, can stabilize frequencies above DDR5-8000 (OC), and includes AI Intelligent Overclocking, AI Smart Cooling 2.0, Two-Way AI Noise Reduction, and AI Smart Networking functionalities.
Notably, the ROG BTF 2.0 Back-Mounted Bundle adopts a new design for easy graphics card removal. There is no need to press the unlock button; simply pull the graphics card from one side of the bracket to remove it from the插槽. The Q-LED Fault Diagnosis Light can also quickly identify motherboard wiring issues and even determine if the memory is installed correctly before powering up.
In terms of interfaces, this motherboard has five M.2 ports, including one that supports PCIe 5.0; dual Thunderbolt 4 Type-C ports with a maximum transfer speed of 40Gbps; a 2.5G wired network card + WiFi 7 wireless network card; and an easily removable antenna plug-and-play design.
It is reported that the ROG MAXIMUS Z790 HERO BTF Back-Mounted Motherboard will be released later, but at present, price information has not been made available. Nevertheless, the launch of the ROG BTF 2.0 Back-Mounted Bundle is undoubtedly set to bring a revolution to the motherboard market, ushering in a new trend.
【来源】https://www.ithome.com/0/745/584.htm
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