台积电CoWoS先进封装产能塞爆，英伟达扩大AI芯片下单量，台积电急找设备供应商增购CoWoS机台
台积电近期传来增产计划，以满足全球大客户英伟达扩大AI芯片下单量、超威、亚马逊等大厂的需求。不过，随着订单量的增加，台积电的CoWoS先进封装产能迅速饱和，面临紧急扩产需求。
为满足更多客户的需求，台积电正在积极扩大产能，并寻求设备供应商的帮助。台积电已经为此增加了设备订单量三成，以确保CoWoS机台的供应能够满足市场预期。
英伟达作为台积电的重要客户，其扩大AI芯片下单量将带动台积电的业绩增长。此外，随着全球大厂对AI芯片的需求日益增加，台积电需要不断优化其生产能力，以满足这些需求。
台积电的CoWoS机台已经成为其业绩增长的重要驱动力。未来，台积电将继续寻求设备供应商的帮助，以确保其能够满足全球客户的需求，并保持市场竞争力。
新闻翻译：
Title: Taiwan’s TSMC Seeks Expansion of Advanced Packaging Capacity with AI Chip Demand
Keywords: TSMC, advanced packaging, AI chip, expansion, equipment supplier
News Content:
Taiwan’s TSMC has recently announced its expansion plan to meet the increasing demand for AI chips from global major customers, including NVIDIA, AWS, and Amazon. However, with the increasing order volume, TSMC’s advanced packaging capacity has been quickly saturated, leading to an emergency expansion plan.
In order to meet the needs of more customers, TSMC is actively expanding its capacity and seeking help from equipment suppliers. TSMC has already increased the equipment orders by 30% to ensure the supply of CoWoS machines can meet market expectations.
NVIDIA, as one of TSMC’s important customers, is expected to drive growth in TSMC’s earnings. In addition, the increasing demand for AI chips from global major companies requires TSMC to continuously optimize its production capabilities to meet these demands.
CoWoS machines have become a key driver of TSMC’s revenue growth. In the future, TSMC will continue to seek help from equipment suppliers to ensure it can meet the needs of global customers and maintain market competitiveness.
【来源】https://www.cls.cn/detail/1471501
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