AMD Reimagines 3D V-Cache: Ryzen 7 9800X3D Features Inverted Stacking for Enhanced Performance
AMD’supcoming Ryzen 7 9800X3D processor is set to feature a significant change in the way its 3D V-Cache is implemented, potentially leading to improved performance and overclocking capabilities.
In a move dubbed X3D Reimagined, AMD has reportedly reversed the stacking order of theCPU Complex Die (CCD) and the 3D V-Cache chip (L3D). Previous generations of X3D processors, such as the 5800X3D and 7800X3D,placed the L3D on top of the CCD. This configuration, however, presented a thermal challenge, as heat generated by the CPU cores had to travel through the L3D to reach the IHS (Integrated Heat Spreader).
According to reliable sources, AMD has now positioned the CCD on top of the L3D in the 9800X3D. This new arrangement allows heat to dissipate directly from the CPU cores to the IHS, similar to non-X3D processors.
To achieve this, AMD has reportedly enlarged the L3D to match the size of the CCD, effectively using it as a substrate. This substrate houses the TSVs (Through-Silicon Vias) that connect the CCD to the underlying fiberglass substrate. This design also paves the way for future advancements, potentially incorporating TSVs for L2 cache per core in future Zen6 processors.
The inverted stacking is expected to result in several benefits:
- Improved Overclocking: The direct contact between the CCD and IHS allows for greater overclocking potential, similar to non-X3D processors.
- Enhanced Thermal Performance: The new configuration eliminates the thermal bottleneck created by the L3D, leading to improved heat dissipation and potentially higher clock speeds.
- Increased TDP and PPT: AMD can now offer higher TDP (Thermal Design Power) and PPT (Package Power Tracking) values for the 9800X3D, further enhancing performance.
The X3D boostmentioned by AMD likely refers to these performance enhancements resulting from the new stacking arrangement.
AMD is expected to launch the Ryzen 7 9800X3D on November 7, 2024. This innovative design promises to deliver significant performance gains and set a new standard for high-performance gamingprocessors.
References:
- AMD Ryzen 7 9800X3D’s CCD sits on top of the 3D V-Cache die, not below
- AMD Ryzen 7 9800X3D: New 3D V-Cache design, higher clocks, and more
Note: This article is based on leaked information and speculation. Official confirmation from AMD isstill pending.
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