AMD’supcoming Ryzen 7 9800X3D processor is set to revolutionize the company’s 3D V-Cache technology with a redesignedchip stacking configuration, according to reliable hardware leaks. The X3D Reimagined tagline, repeatedly used in AMD’s promotional materials, hints ata significant change in the architecture.
In previous generations of X3D processors, like the 5800X3D (Vermeer-X) and 7800X3D (Raphael-X), theL3D (3D V-Cache) chip was stacked on top of the CCD (CPU Complex Die). This arrangement placed the 32MB L3 cache in the central area of the CCD, while the structural silicon blocks, responsible for heat dissipation from the CPU cores, were positioned on the edges.
The leak suggests that AMD has inverted this stack for the 9000X3D series. The Zen 5 CCD is now positioned on top, with the L3D located beneath it, directly below thecentral area of the CCD. This allows for direct heat transfer from the CPU cores to the IHS (Integrated Heat Spreader), similar to non-X3D processors.
This change is reportedly achieved by expanding the L3D to match the size of the CCD, effectively creating a substrate. Through-Silicon Vias (TSVs) are then used to connect the CCD to the underlying fiberglass substrate. This approach not only enables the 64MB 3D V-Cache to be added to the 32MB on-die L3 cache but also paves the way for future advancements. AMD couldpotentially design CCDs with TSVs for each core’s L2 cache in the Zen 6 generation.
The inverted stack also explains the significance of X3D boost. With direct contact between the CCD and IHS, the X3D processor can achieve the same overclocking capabilities asnon-X3D chips. This improved heat dissipation allows AMD to maintain similar TDP (Thermal Design Power) and PPT (Package Power Tracking) values for the 9800X3D, enabling higher clock speeds compared to previous X3D models.
The Ryzen 7 9800X3D is expected to launch on November 7, 2024. This innovative architecture, coupled with the enhanced performance and overclocking potential, promises to deliver a significant leap forward for AMD’s 3D V-Cache technology.
References:
- 9550pro(Hardware Leak Source)
- AMD Promotional Materials
Note: This article is based on leaked information and should be considered speculative until officially confirmed by AMD.
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