Samsung Dismantles Advanced Packaging Team, Packaging Expert Lin Jun-chengRumored to Be Sought by Chinese Chipmakers
Seoul, South Korea – Samsung Electronics has reportedly disbanded its advanced packaging team, raising questions about the future of the company’s ambitions in this crucial area of semiconductor technology. Thenews comes amid rumors that Lin Jun-cheng, a former TSMC executive who joined Samsung in early 2023, is being courted by Chinesesemiconductor manufacturers.
Lin Jun-cheng, who previously held the position of Vice President of Advanced Packaging at Samsung, was brought on board to bolster the company’s efforts in this field. He was tasked with leading a Task Force team aimed at catching up to TSMC, the world’s leading chipmaker, in advanced packaging technology. However, according to sources cited by Taiwanese media outlet Digitimes, the Task Force has been disbanded, and Lin Jun-cheng’s two-year contract with Samsung is nearing its end, with the company reportedly not planning to renew it.
While Samsung has confirmed the dissolution of the Task Force, attributing it to organizational restructuring, the company has remained tight-lipped about Lin Jun-cheng’s departure and any potential futureplans.
Industry insiders have commented on the situation, suggesting that while Lin Jun-cheng possesses significant expertise in research and development, his overall impact has been limited. His influence, they argue, pales in comparison to that of Liang Mengsong, another former TSMC executive who made a significant mark in advanced process technology.
Lin Jun-cheng’s departure from TSMC several years ago, coupled with his inability to attract key talent from his former employer, has reportedly hampered his ability to drive progress in advanced packaging research.
Furthermore, the growing gap between Samsung and TSMC in advanced process technology has added another layer ofcomplexity. Even with Lin Jun-cheng’s impressive portfolio of over 500 semiconductor patents, industry experts believe that a single individual cannot single-handedly propel Samsung’s advanced packaging technology to surpass TSMC.
The potential departure of Lin Jun-cheng to a Chinese semiconductor manufacturer has sparked further speculation.China has been aggressively investing in its domestic chip industry, aiming to reduce its reliance on foreign suppliers. The acquisition of a seasoned expert like Lin Jun-cheng would be a significant boost to their efforts.
However, the move could also raise concerns about intellectual property theft and potential security risks. Samsung, known for itsstrong presence in the memory chip market, has been actively trying to catch up to TSMC in the advanced logic chip segment. The company’s struggles in this area have been exacerbated by the recent departure of several key executives, including Liang Mengsong.
The dismantling of the advanced packaging team and the potential loss ofLin Jun-cheng further highlight the challenges Samsung faces in its quest to compete with TSMC. The company’s future in advanced packaging technology remains uncertain, and the industry will be closely watching to see how it navigates this critical juncture.
【source】https://www.ithome.com/0/791/422.htm
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