全球半导体行业迎来重大合作，SK海力士与台积电两大巨头于当地时间周五宣布，双方已签订谅解备忘录，将联手开发新一代高带宽内存（HBM）技术——HBM4芯片。这一合作旨在整合HBM与逻辑层的先进封装技术，旨在为未来的高性能计算和数据中心应用提供更强大的性能支持。
根据公告，SK海力士与台积电将共同致力于第六代HBM产品的研发，即HBM4。这一新型芯片预计将在2026年开始大规模生产。HBM4芯片的推出，将进一步提升数据传输速度和能效，为人工智能、机器学习、高性能计算等领域带来革命性的进步。
SK海力士与台积电的此次合作，标志着全球半导体行业的深度整合趋势，两家公司在技术领域的优势互补，有望加速创新进程，推动行业标准的设定。此次联手不仅将影响两家公司的市场地位，也将对全球半导体供应链产生深远影响，为未来的科技发展注入新的动力。
双方表示，将充分利用各自在内存和逻辑芯片制造领域的专业技能，以确保HBM4芯片的研发与生产达到业界最高标准。此次合作也体现了在全球化背景下，企业间通过协同创新应对市场挑战的策略，旨在满足不断提升的高性能计算需求。
这一消息在财联社发布后，引起了业界的广泛关注。市场分析人士认为，SK海力士与台积电的联手，预示着半导体行业在先进封装技术上的新突破，将为全球科技产业的持续发展提供重要支持。
英语如下：
**News Title:** “SK Hynix and TSMC Join Forces to Launch Innovative HBM4 Chips in 2026”
**Keywords:** SK Hynix, TSMC, HBM4 Chips
**News Content:**
In a major collaboration in the global semiconductor industry, SK Hynix and TSMC, two industry giants, announced on Friday local time that they have signed a memorandum of understanding (MoU) to jointly develop the next-generation High Bandwidth Memory (HBM) technology, the HBM4 chip. This partnership aims to integrate advanced packaging technology for HBM with logic layers, providing enhanced performance support for future high-performance computing and data center applications.
According to the announcement, SK Hynix and TSMC will collaborate on the development of the sixth-generation HBM product, HBM4. Mass production of this innovative chip is expected to commence in 2026. The HBM4 chip is anticipated to boost data transfer speeds and energy efficiency, bringing revolutionary advancements to fields such as artificial intelligence, machine learning, and high-performance computing.
This collaboration between SK Hynix and TSMC signifies a deepening integration trend in the global semiconductor sector, with the two companies’ complementary technological strengths expected to accelerate innovation and contribute to setting industry standards. The partnership will not only impact the market positions of both companies but also have far-reaching effects on the global semiconductor supply chain, injecting new momentum into future technological development.
Both parties stated that they will leverage their respective expertise in memory and logic chip manufacturing to ensure that the HBM4 chip development and production meet the industry’s highest standards. This collaboration exemplifies the strategy of companies cooperating in an increasingly globalized context to address market challenges and meet the growing demands for high-performance computing.
The announcement, made via Caixin Global, has attracted significant attention from the industry. Market analysts believe that the alliance between SK Hynix and TSMC signals a new breakthrough in advanced packaging technology for the semiconductor sector, providing crucial support for the sustained growth of the global tech industry.
【来源】https://www.cls.cn/detail/1652041
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