德国慕尼黑的半导体初创公司Semron近日宣布，成功完成了一轮730万欧元（约790万美元）的种子轮融资，用于支持其创新的3D AI芯片技术研发。这轮融资由Join Capital领投，SquareOne、OTB Ventures、著名企业家Hermann Hauser的Onsight Ventures以及一些现有的投资者共同参与。
Semron公司专注于开发先进的AI芯片技术，旨在彻底改变智能设备的半导体架构。其突破性的3D AI芯片技术有望提升智能设备的计算能力和能效，为物联网、自动驾驶、人工智能等领域带来革新。此次资金注入将加速Semron的研发进程，推动其技术商业化，并可能开启新的市场机遇。
Join Capital等投资方对Semron的技术前景表示了高度期待，认为其3D AI芯片技术有可能重塑行业标准。此次融资不仅为Semron提供了必要的资金支持，同时也为其在全球半导体市场的竞争中奠定了坚实的基础。
随着全球对AI技术和高效能芯片需求的不断增长，Semron的创新技术有望在未来的智能设备市场中占据一席之地。这家初创公司的发展动态将备受业界关注，期待其能为半导体行业带来更多的惊喜和突破。
英语如下：
**News Title:** “German Semron AI Chip Startup Raises $7.9M Seed Funding to Revolutionize 3D Semiconductor Technology”
**Keywords:** Semron, AI chips, seed round
**News Content:** Munich-based semiconductor startup Semron has recently announced that it has successfully closed a €7.3 million ($7.9 million) seed funding round to support the development of its innovative 3D AI chip technology. The round was led by Join Capital, with participation from SquareOne, OTB Ventures, Onsight Ventures, backed by renowned entrepreneur Hermann Hauser, as well as several existing investors.
Semron focuses on developing advanced AI chip technology with the aim of transforming the semiconductor architecture in smart devices. Its groundbreaking 3D AI chip technology promises to enhance computational capabilities and energy efficiency in smart devices, paving the way for innovation in the Internet of Things (IoT), autonomous driving, and artificial intelligence sectors. The fresh injection of funds will accelerate Semron’s R&D process, drive commercialization of its technology, and potentially open up new market opportunities.
Investors, such as Join Capital, have expressed high expectations for Semron’s technology, believing that its 3D AI chip technology could redefine industry standards. This funding not only provides the necessary financial backing but also lays a solid foundation for Semron’s competitiveness in the global semiconductor market.
With the increasing global demand for AI technology and high-performance chips, Semron’s innovative technology is poised to secure a position in the future smart device market. The development of this startup will be closely watched by the industry, with anticipation for more surprises and breakthroughs it may bring to the semiconductor sector.
【来源】https://venturebeat.com/ai/semron-raises-7-9m-for-ai-chips-with-3d-packaging/
Views: 1