【明日GTC大会前夕，英伟达Blackwell GPU显存规格曝光：B100将搭载192GB HBM3e显存】
据最新爆料，全球知名图形处理器制造商英伟达（NVIDIA）将在明日的GTC 2024（GPU技术大会）主题演讲中，由公司创始人黄仁勋揭晓备受期待的下一代GPU架构——Blackwell。此次，英伟达或将发布两款显存容量不同的新品，B100 GPU将配备192GB HBM3e高带宽显存，而B200型号则有望达到288GB的显存容量。
据消息源XpeaGPU透露，B100 GPU将采用台积电先进的CoWoS-L（晶圆基片芯片）2.5D封装技术，通过堆叠芯片以提升处理性能，同时实现空间节省和功耗降低。这一设计中，B100的两个计算芯片将与8个8-Hi HBM3e显存堆栈相连，从而实现总计192GB的显存容量。值得一提的是，AMD的Instinct MI300 GPU已搭载相同容量的192GB HBM3显存，但采用了8个HBM3芯片。
关于更高端的B200 GPU，据爆料称其将利用12-Hi技术实现更大的显存容量，达到288GB。不过，目前尚未明确这一型号是采用HBM3e还是更先进的HBM4技术。明日的GTC 2024大会将为我们揭开更多关于Blackwell架构的神秘面纱，敬请期待。
来源：IT之家
英语如下：
News Title: “NVIDIA GTC 2024 Preview: Jensen Huang可能推出Blackwell GPU with up to 288GB VRAM, revolutionizing the industry”
Keywords: NVIDIA GPU, Blackwell architecture, HBM3e VRAM
News Content: “NVIDIA Blackwell GPU VRAM specifications leak ahead of GTC 2024: B100 to feature 192GB HBM3e VRAM”
According to recent leaks, renowned graphics processing unit (GPU) manufacturer NVIDIA is set to unveil its much-anticipated next-generation GPU architecture, Blackwell, during the keynote at tomorrow’s GTC 2024 (GPU Technology Conference) by the company’s founder, Jensen Huang. NVIDIA is expected to introduce two new GPUs with varying VRAM capacities, with the B100 GPU sporting 192GB of HBM3e high-bandwidth memory, while the B200 model could boast an impressive 288GB.
Sources from XpeaGPU reveal that the B100 GPU will employ TSMC’s advanced CoWoS-L (Chip-on-Wafer-on-Substrate) 2.5D packaging technology, stacking chips to enhance processing performance while conserving space and reducing power consumption. In this design, two compute chips of the B100 will be interconnected with eight 8-Hi HBM3e memory stacks, amounting to a total of 192GB VRAM. Notably, AMD’s Instinct MI300 GPU already features the same 192GB HBM3 VRAM capacity, albeit with eight HBM3 chips.
As for the higher-end B200 GPU, rumors suggest it will leverage 12-Hi technology to accommodate the larger 288GB VRAM capacity. However, it is currently unclear whether this model will utilize HBM3e or the more advanced HBM4 technology. Tomorrow’s GTC 2024 event promises to shed more light on the mysteries surrounding the Blackwell architecture. Stay tuned.
Source: IT Home
【来源】https://www.ithome.com/0/756/310.htm
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