近日，台积电在ISSCC 2024大会上展示了其最新的高性能计算与AI芯片封装技术。这一技术是在现有3D封装基础上，整合了硅光子技术，旨在提升互联效果并降低功耗。台积电业务开发资深副总裁张晓强表示，新技术的目标是增加HBM和Chiplet小芯片的封装数量，从而提高AI芯片性能。此技术的推出，有望为AI芯片领域带来新的突破。
英文标题：TSMC Unveils New AI Chip Packaging Technology
英文关键词：TSMC, AI Chips, Packaging Technology
英文新闻内容：
TSMC has recently showcased its latest packaging technology for high-performance computing and AI chips at the ISSCC 2024 conference. The technology, which integrates silicon photonics into existing 3D packaging, aims to enhance interconnectivity and reduce power consumption. According to TSMC Senior Vice President of Business Development, Michael Chang, the new technology is designed to increase the packaging of HBM and Chiplet small chips, ultimately improving the performance of AI chips. The introduction of this technology is expected to bring new breakthroughs to the AI chip sector.
【来源】https://www.cls.cn/detail/1601181
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