随着全球市场对高带宽内存（HBM）需求的增长，韩国半导体巨头SK海力士宣布，将在韩国本土投资超过10亿美元，用于优化芯片封装工艺、扩大产能。此举旨在抓住市场机遇，并为其未来几代HBM产品奠定坚实基础。此外，SK海力士还计划在美国建立价值数十亿美元的先进封装厂，显示出其全球扩张的雄心。
英文标题：SK Hynix to Invest Over $1 Billion in Korea for Chip Packaging, Eyes Expansion in the U.S.
英文关键词：chip packaging, HBM technology, global expansion
英文新闻内容：
South Korean semiconductor giant SK Hynix has announced plans to invest over $1 billion in its domestic chip packaging operations to capitalize on the growing demand for high bandwidth memory (HBM). The move is aimed at strengthening its position in the market and laying the groundwork for future generations of HBM products. Additionally, the company intends to establish advanced packaging facilities in the U.S., valued at billions of dollars, showcasing its ambition for global expansion.
【来源】https://www.cls.cn/detail/1613149
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