德国慕尼黑的半导体初创公司Semron近日成功筹集了730万欧元（约合790万美元）的种子资金。这笔资金将用于支持其突破性的3D AI芯片技术研发，该技术有望重塑智能设备的半导体领域。
此次融资由Join Capital领投，SquareOne、OTB Ventures、Hermann Hauser的Onsight Ventures以及现有投资者参与。Semron的3D AI芯片技术具有巨大潜力，有望改变智能设备的传统半导体架构。
随着人工智能技术的飞速发展，AI芯片成为各大科技公司争相研发的焦点。德国初创公司Semron凭借创新的3D AI芯片技术在众多竞争者中脱颖而出，吸引了众多投资者的关注。此次融资将助力Semron进一步推进技术研发，为智能设备带来更高效、更强大的性能。
英文翻译：
News title: German startup Semron raises $7.9 million in seed funding
Keywords: Semron, AI chip, funding
News content:
German semiconductor startup Semron has successfully raised €7.3 million (approximately $7.9 million) in seed funding. The funds will be used to support the development of its groundbreaking 3D AI chip technology, which is aimed at transforming the semiconductor field in smart devices.
The round was led by Join Capital, with participation from SquareOne, OTB Ventures, Onsight Ventures of Hermann Hauser, and existing investors. Semron’s 3D AI chip technology has huge potential and is expected to change the traditional semiconductor architecture of smart devices.
With the rapid development of artificial intelligence technology, AI chips have become a hotspot for technology companies worldwide. German startup Semron has stood out among numerous competitors with its innovative 3D AI chip technology, attracting attention from many investors. This funding will enable Semron to further advance its technology development, bringing more efficient and powerful performance to smart devices.
【来源】https://venturebeat.com/ai/semron-raises-7-9m-for-ai-chips-with-3d-packaging/
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