【台积电创新封装技术引领高性能计算与AI芯片新纪元】在刚刚落幕的2024年ISSCC（国际固态电路会议）上，全球半导体巨头台积电披露了一项革命性的封装技术，旨在为高性能计算和人工智能（AI）芯片领域带来重大突破。这项新技术在台积电已有的3D封装技术基础上，融合了硅光子技术，以优化芯片间的互联性能，同时降低功耗。
据台积电业务开发资深副总裁张晓强透露，这项创新的封装技术能够有效地整合更多的高带宽内存（HBM）和Chiplet小芯片，从而显著提升AI芯片的运算效能和处理速度。硅光子技术的应用，利用光信号传输数据，有望解决传统电子信号在高速传输时面临的功耗和延迟问题，为高性能计算应用提供了更高效、低耗的解决方案。
台积电的这一举措再次彰显了其在半导体技术领域的领导地位，同时也预示着未来AI芯片设计和制造将进入一个全新的时代。随着数据处理需求的持续增长，高性能计算和AI芯片的性能优化将成为业界关注的焦点。台积电的这项新技术无疑为业界提供了一条可能的路径，以应对不断升级的计算挑战。
英语如下：
**News Title:** “TSMC’s Innovative Packaging Technology Integrates Silicon Photonics, Paving the Way for a New Era of High-Performance AI Chips”
**Keywords:** TSMC, new packaging technology, AI chips
**News Content:** **TSMC’s Innovative Packaging Technology Leads High-Performance Computing and AI Chips into a New Era** At the recently concluded 2024 International Solid-State Circuits Conference (ISSCC), global semiconductor giant TSMC unveiled a groundbreaking packaging technology aimed at making significant strides in high-performance computing and artificial intelligence (AI) chips. This new technology, built upon TSMC’s existing 3D packaging capabilities, incorporates silicon photonics to optimize inter-chip connectivity while reducing power consumption.
According to TSMC’s Senior Vice President of Business Development, Xiaoqiang Zhang, this innovative packaging technology effectively integrates more high-bandwidth memory (HBM) and Chiplet modules, thereby significantly enhancing the computational efficiency and processing speed of AI chips. The application of silicon photonics, which employs light signals for data transmission, addresses power consumption and latency issues encountered with traditional electronic signals in high-speed transfers, offering a more efficient and power-friendly solution for high-performance computing applications.
TSMC’s move underscores its leadership position in semiconductor technology and foreshadows a new era in AI chip design and manufacturing. As the demand for data processing continues to rise, optimizing the performance of high-performance computing and AI chips will be a key focus for the industry. TSMC’s cutting-edge technology presents a viable pathway to address the escalating computational challenges.
【来源】https://www.cls.cn/detail/1601181
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