上海的陆家嘴

全球半导体行业的两大巨头SK海力士与台积电于当地时间周五宣布了一项重大合作动向。双方已签署谅解备忘录,决定联手开发新一代的高带宽内存(HBM)技术——HBM4芯片。这一合作标志着业界在先进封装技术领域的又一里程碑,预期将在2026年实现大规模生产。

SK海力士,作为全球领先的内存半导体供应商,与台积电,全球最大的专业集成电路制造服务公司,此次合作将整合各自在HBM和逻辑层封装技术的专长。第六代HBM产品(HBM4)的开发,旨在满足不断增长的高性能计算、人工智能和数据中心领域对更高数据传输速度和容量的需求。

两家公司在公告中表示,HBM4芯片将提供显著提升的性能,有望推动业界标准的提升,进一步巩固他们在全球半导体市场的领先地位。此次合作不仅展示了两家公司应对技术挑战的决心,也预示着未来几年半导体行业在技术创新上的持续突破。

此次合作对于全球半导体产业具有深远影响,双方的联合研发将可能重塑高性能计算领域的格局,并为2026年的市场投放奠定坚实基础。财联社作为消息来源,证实了这一具有前瞻性的技术合作项目,引发了业界的广泛关注和期待。

英语如下:

**News Title:** “SK Hynix and TSMC Join Forces to Launch Innovative HBM4 Chips in 2026”

**Keywords:** SK Hynix, TSMC, HBM4 Chips

**News Content:**

Global semiconductor giants SK Hynix and TSMC announced a major collaborative effort on Friday local time. The two companies have signed a memorandum of understanding to jointly develop the next-generation High-Bandwidth Memory (HBM) technology, the HBM4 chip, with plans for mass production in 2026.

SK Hynix, a leading global supplier of memory semiconductors, and TSMC, the world’s largest dedicated集成电路 manufacturing services provider, will combine their expertise in HBM and logic layer packaging technologies. The development of the sixth-generation HBM product (HBM4) aims to cater to the increasing demand for higher data transfer speeds and capacity in high-performance computing, artificial intelligence, and data center applications.

In a joint statement, the companies claimed that the HBM4 chips will deliver substantial performance improvements, potentially driving industry standards upward and reinforcing their positions in the global semiconductor market. This collaboration not only demonstrates their commitment to tackling technological challenges but also signals continued breakthroughs in innovation within the semiconductor industry in the coming years.

This partnership carries significant implications for the global semiconductor sector, as their joint R&D efforts are poised to reshape the landscape of high-performance computing and lay a solid foundation for market introduction in 2026. The financial news agency, Cailian Press, confirmed the forward-looking technology collaboration, attracting widespread attention and anticipation from the industry.

【来源】https://www.cls.cn/detail/1652041

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